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HGSEMI 74HC573M/TR 74HC573M
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI 74HC573M / TR
- Type
- HGSEMI
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- 74HC573M/TR
- Electronic Component
- 1
- Package
- SOP-20
- Electronic Component
- Latch
- Electronic Component
- 74HC
- Electronic Component
- 0.78g
- Electronic Component
- 1
- Channel Count
- 8
- Electronic Component
- BM0265148918
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2V~6V
- Output Type
- Electronic Component
- Logic Type
- D Latch
- Current(IOH)
- 7.8mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
74HC573M/TR 8位三态D锁存器产品概述
一、产品核心定位与基本功能
74HC573M/TR是华冠半导体（HGSEMI）推出的8位三态D型锁存器，属于高速CMOS逻辑系列（74HC）器件。其核心功能是实现8位并行数据的透明锁存与三态输出控制：
- 锁存使能端（LE）为高电平时，输入数据（D0D7）直接传送到输出端（Q0Q7），呈“透明”传输模式；
- LE为低电平时，输出端锁存当前输入数据，保持不变直至LE再次置高；
- 输出使能端（OE）为低电平时，输出端正常驱动；OE为高电平时，输出端呈高阻态，可脱离总线避免冲突，适配并行总线共享场景。
二、关键电气与性能参数解析
该器件的参数覆盖了应用设计的核心需求，具体如下：
1. 电源与低功耗特性
- 工作电压范围：2V~6V，兼容2.5V、3.3V、5V等常见系统电压，无需额外电平转换；
- 静态电流：仅8μA，待机状态下功耗极低，符合低功耗设计要求。
2. 驱动能力
- 拉电流（IOH）：7.8mA；
- 灌电流（IOL）：7.8mA；
可直接驱动LED、小型继电器或中等负载，无需额外驱动电路。
3. 时序性能
- 传播延迟（tpd）：典型值14ns，在74HC系列中属于高速器件，满足实时数据传输需求。
4. 环境适应性
- 工作温度范围：-40℃~+85℃，达到工业级温度标准，可在户外、车间等温差较大的环境中稳定工作。
5. 通道数
- 8位并行输入输出，支持一次处理8位数据，适配并行总线、地址锁存等场景。
三、封装与典型应用场景
1. 封装形式
采用SOP-20（小外形封装，20引脚），尺寸紧凑，适合贴片式表面贴装（SMD）工艺，便于PCB板高密度布局，兼容手工焊接与自动化贴装。
2. 典型应用
- 微处理器地址锁存：在8051等8位MCU中，地址与数据总线复用，需用74HC573锁存低8位地址，分离地址与数据信号，实现内存/外设访问；
- 并行总线接口：多个器件可挂接同一总线，通过控制OE端实现分时共享，适配多数据源/多负载系统；
- 数据寄存器：工业控制、LED点阵显示中临时存储8位控制/显示数据，保持输出稳定；
- 通用锁存：传感器数据采集、按键扫描数据暂存等需要临时存储8位并行数据的场景。
四、品牌与可靠性优势
华冠半导体（HGSEMI）作为国内逻辑器件专业厂商，74HC573M/TR符合国际工业标准，产品一致性好、可靠性高：
- 经过温度循环、湿度测试、电应力测试等严格可靠性验证；
- 可替代进口同类器件，成本优势明显，适合批量生产应用。
总结
74HC573M/TR凭借高速响应、低功耗、宽电压、工业级温度及三态输出等特性，成为并行数据存储与总线接口领域的高性价比选择，广泛适用于消费电子、工业控制、通信等领域。
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