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HGSEMI ULN2003N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI ULN2003N
- Type
- HGSEMI
- Minimum package
- 25 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- ULN2003N
- Electronic Component
- 1
- Package
- DIP-16
- Electronic Component
- Darlington Transistor Array
- Electronic Component
- 1.56g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Electronic Component
- BM0264548634
- Operating Temperature
- 40℃~+85℃
- Current(on)
- 0.93mA
- Current(off)
- 65uA
- Electronic Component
- Electronic Component
- Electronic Component
- 25
- Collector Current(Ic)
- 500mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ULN2003N 七路达林顿阵列 — 产品概述
一、主要参数
ULN2003N（HGSEMI 华冠）为高电压、大电流的七路达林顿晶体管阵列，主要电气参数如下：
- 通道数：7 路（公共发射极，集电极开路输出）
- 集射极击穿电压 Vceo：50 V
- 单通道额定连续集电极电流 Ic：500 mA（峰值可承受 600 mA，受散热与占空比限制）
- 最大输入电压 VI：30 V（输入端耐压）
- 集电极漏电流 Ice (关断)：≤50 μA
- 输入电流（导通）Iin(on)：约 0.93 mA；（关断）Iin(off)：约 65 μA
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：DIP-16
二、产品特点
- 七个独立达林顿对，内部带限流电阻，直接驱动 TTL/CMOS 逻辑电平信号；适合与常见逻辑系列直接接口（ULN2003 对应 5V TTL/CMOS；ULN2004 可兼容更高电压的 CMOS/PMOS）。
- 每路输出为集电极开路结构，便于将负载接至外部正电源，配合公共抑制二极管（用于感性负载反向箝位）可直接驱动继电器线圈、步进电机绕组等感性负载。
- 低成本、封装小巧，适合插针式电路板快速开发与更换。
三、典型应用
- 驱动螺线管、继电器、直流电机与步进电机（中小功率）
- LED 点阵或数码管的高电流缓冲驱动
- 热敏打印头、灯丝灯及其他感性或容性负载
- 作为逻辑到功率接口的缓冲器或低边开关
四、使用建议与注意事项
- 抑制二极管：当驱动感性负载时务必将 COM（公共二极管阳极）连接到负载正电源，以保证反向电动势被安全箝位。
- 散热管理：尽管单通道额定 500 mA，但在长时间大电流工作时会产生显著功耗；应注意 PCB 铜箔散热、必要时并联通道或减小占空比/使用外部散热。峰值 600 mA 只适用于短脉冲条件。
- 输入电流与电平：导通输入电流约 0.93 mA，适配 5V TTL/CMOS 输出口；输入电压不宜超过器件最大 VI（30 V）。
- 漏电流与接收灵敏度：关断时集电极漏电流约 50 μA，低电流负载需注意泄漏影响。
- 并联与冗余：若单通道电流不足，可考虑并联多个通道并进行合理热分配，但需注意器件内阻和匹配。
五、封装与采购信息
- 品牌：HGSEMI（华冠）
- 封装：DIP-16，便于面包板与通孔 PCB 应用；也常见有 SOP 等表面贴装版本。
- 替代型号：通用兼容 ULN2003/ULN2003A 器件在功能与脚位上高度相容，选型时注意温度与功耗参数差异。
本器件以其可靠的达林顿结构、内置抑制二极管与兼容常见逻辑接口的特性，广泛用于工业控制、消费电子与快速原型开发场景。选用时请综合考虑负载类型、平均功率与散热设计，保证长期稳定工作。
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