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HRE CSA0402X5R105K100GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402X5R105K100GT
- Type
- 0402
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402X5R105K100GT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264778563
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402X5R105K100GT 产品概述
一、产品简介
CSA0402X5R105K100GT 是 HRE（芯声）推出的一款贴片多层陶瓷电容（MLCC），主要参数为：容值 1µF、精度 ±10%（K）、额定电压 10V、介质材料 X5R、封装 0402（约 1.0mm × 0.5mm）。该器件针对高密度贴装、小型化终端设备的去耦、滤波与储能需求，提供体积小、寄生参数低、可靠性好的电容解决方案。
二、主要电气与物理特性
- 容值：1µF（标称，标识码 105）
- 容差：±10%（K）
- 额定电压：10V DC
- 介质：X5R（-55°C 至 +85°C 范围内温度系数在 ±15% 级别）
- 封装：0402（英制 0.04"×0.02"；公制约 1.0×0.5 mm）
- 典型性能：低等效串联电阻（ESR）、良好的高频特性，泄漏电流极小（通常为 μA 级或更低，受温度/电压影响）
三、性能注意事项与设计建议
- 偏压效应：X5R 系陶瓷在直流偏压下会出现电容下降（随工作电压上升电容值会减小），在实际电路中应根据工作电压验证有效容量，关键场合建议取样测试。
- 温度特性：X5R 在 -55°C 到 +85°C 范围内电容变化受限于约 ±15%；用于精密定时或高稳定度场合并不适合。
- 降额使用：建议在要求高可靠性的电源去耦/滤波场合对额定电压做适度降额（如留有 20%~30% 余量），以减少偏压损失和提高长期可靠性。
- PCB 布局：靠近电源引脚放置以获得最佳去耦效果，遵循最短回流路径、对称焊盘设计以降低 tombstone 风险。
四、可焊性与可靠性
- 推荐采用无铅回流工艺（遵循 IPC/JEDEC 无铅回流曲线），注意回流温度曲线与焊接次数限制。
- 0402 封装体积小、易受机械应力影响，避免在 PCB 施压或弯曲后焊接，必要时采用应力缓冲设计或填充工艺以减少裂纹风险。
- 产品可提供 RoHS 符合性与常规出厂筛选，特定行业（如汽车、航空）建议索取可靠性测试报告与认证资料进行验证。
五、典型应用领域
- 移动设备、可穿戴设备和无线终端的电源去耦与滤波
- 模拟/数字混合电路附近的局部旁路电容
- 高密度 PCB 中的旁路、退耦与小容量储能
- 器件空间受限的消费电子与工业控制设备
六、选型与售后建议
在最终选型前建议获取样品并在目标电压、温度与频率条件下做直流偏压、频率响应与寿命测试。若产品用于关键或高可靠性场合，请联系 HRE（芯声）获取详细的电气特性曲线、批次一致性数据与可追溯的质量报告。
如需进一步的规格书、封装尺寸图、回流工艺建议或样品申请，我可以协助整理并提供下一步的工程支持。
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