Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CGA0603X5R225M160JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X5R225M160JT
- Type
- 0603
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X5R225M160JT
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495126
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X5R225M160JT 产品概述
一、产品简介
CGA0603X5R225M160JT 为 HRE（芯声）提供的多层陶瓷电容，标称容量 2.2µF，公差 ±20%（M），额定电压 16V，介质为 X5R。该器件以 0603（1608公制）贴片封装为主，适用于空间受限且需较大容值的去耦与滤波场合。
二、主要电气参数
- 容值：2.2µF（标称）
- 容差：±20%（M）
- 额定电压：16V DC
- 温度特性：X5R（工作温度范围 -55°C 至 +85°C，容量变化限幅约 ±15%）
说明：X5R 为中等性能介质，具备较高介电常数但存在温度与直流偏置下容量下降的特性，设计时应注意实际工作条件下的有效容量。
三、封装与物理特性
- 尺寸：0603（约 1.6 mm × 0.8 mm，厚度随厂商工艺略有不同）
- 电极与外观：常见为银合金或镀金属端电极，适配自动贴装工艺。
该尺寸在板级空间利用率与机械强度之间取得平衡，适合中高密度装配。
四、典型应用
- 电源去耦与旁路（CPU、MCU、电源管理芯片）
- 高频滤波与稳压器输入/输出滤波
- 模拟电路耦合/旁路
- 移动设备、工业控制、通信设备及消费电子等对体积与性能有平衡需求的场景
五、设计与装配建议
- 直流偏置与温度影响：X5R 在施加电压或高温时容量会下降，关键电路建议留有裕量或采用降额使用（设计时考虑实际工作容量）。
- 焊接工艺：推荐遵循无铅回流曲线，避免过长高温峰值以降低裂纹风险。
- PCB 布局：去耦电容靠近供电引脚放置，短且宽的走线以降低寄生阻抗。
- 机械应力：避免在贴片后弯曲 PCB 或在电容上施加应力，减少应力导致的微裂纹。
六、可靠性与质量控制
HRE（芯声）器件通常通过批次测试与结论性可靠性测试（如温度循环、湿热、振动与寿命试验），具体认证与测试报告可向供应商索取。陶瓷电容对机械冲击与热冲击敏感，提供合理的库存与运输防护可降低返修率。
七、订购提示与等效替换
型号中常见编码含义示例：0603 表示封装，X5R 表示介质，225（即 22×10^5 pF）对应 2.2µF，M 表示 ±20%，16V 为额定电压。若需替换或备件，可在同规格封装、相同介质与电压条件下选用其他品牌同类件，但请验证在工作电压与温度下的实际容量与电气性能。
如需详细数据手册（电容随频率/温度/偏压曲线、机械尺寸图、回流曲线及可靠性认证），可提供料号以便获取完整资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
