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HRE CGA1206X5R107K6R3NT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA1206X5R107K6R3NT
- Type
- 1206
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA1206X5R107K6R3NT
- Electronic Component
- 1
- Electronic Component
- 100uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.079g
- Electronic Component
- 1
- Electronic Component
- BM0264778646
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA1206X5R107K6R3NT 产品概述 — HRE(芯声) 1206贴片多层陶瓷电容 100µF ±10% 6.3V X5R
一、产品简介
CGA1206X5R107K6R3NT 为 HRE(芯声) 系列高容值MLCC（多层陶瓷电容），规格为1206封装（3216公制），额定电压6.3V，额定电容100µF，公差±10%（K），温度特性等级X5R。该型号面向需要大容量、低内阻、高频去耦与能量储存的消费类与工业类电源应用。
二、主要特性
- 容值：100µF，容差 ±10%。
- 额定电压：6.3V（直流使用）。
- 温度系数：X5R（-55°C至+85°C范围内容值变化受限，一般在±15%以内）。
- 封装：1206（适合自动贴装与回流焊工艺）。
- 低等效串联电阻（ESR）与良好高频特性，适合瞬态抑制与去耦。
三、电气与环境行为要点
- X5R 高介电常数材料在温度与电压下有一定容值漂移，工作温度范围通常至+85°C；在更高温度下容值会下降。
- 直流偏置效应显著：在靠近额定电压工作时，实际可用容值会明显低于标称值（具体降额随制造工艺不同），设计时应参考厂方的DC bias曲线并留余量。
- 良好的频率响应，适合电源滤波与去耦，但并不等同于低ESR电解电容在大纹波能量缓冲上的表现。
四、封装与焊接建议
- 按照无铅回流工艺规范进行焊接，遵循厂方推荐温度曲线以避免裂纹与机械应力。
- 贴装时避免在元件两侧产生过大机械应力（PCB孔位、剪切或不均匀焊膏量可能引发裂纹）。
- 对于高震动或高应力环境，考虑增加边缘保护或改用更大封装/不同材料方案。
五、典型应用场景
- 低压电源轨（如3.3V、5V）的大容量旁路与瞬态响应提升。
- 手机、平板、笔电的电源去耦与能量储备。
- 摄像头模块、通信设备及各类消费电子的滤波与稳压辅助。
六、选型与使用注意
- 若电路工作电压接近或等于6.3V，建议按DC bias性能降额选择或并联多只以保证有效容值。
- 在高温或高可靠性场合（汽车、航天）优先考虑温度系数与寿命更高的方案，必要时选用高压或电解/固态电容结合。
- 设计时预留电容容值裕度，并参照厂商数据手册的温度、电压与频率特性曲线进行验证。
七、存储与可靠性
- 避光、干燥保存，避免长期受潮或极端温度。
- 大批量应用前建议进行样品测试（焊接可靠性、热循环、振动与电气特性验证），确保在目标工况下满足性能需求。
如需厂方数据手册、DC bias 曲线或样品测试报告，可联系HRE(芯声)或供应商获取详细参数与推荐的PCB封装尺寸。
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