WMSIC Electronic Components

HRE CGA0805X5R226K100MT

ModelCGA0805X5R226K100MT
Package0805
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0805X5R226K100MT
Type
0805
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0805X5R226K100MT
Electronic Component
1
Electronic Component
22uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0264778645
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HRE(芯声) CGA0805X5R226K100MT 产品概述

一、产品简介

CGA0805X5R226K100MT 为 HRE(芯声)系列 X5R 介质多层陶瓷电容,标称容量 22 µF,容差 ±10%(K),额定电压 10 V,封装 0805(约 2.0 × 1.25 mm)。该型号面向对体积与容值有一定要求的贴片去耦与旁路应用,兼顾成本与体积优化,适合消费电子和一般工业类电源滤波场合。

二、主要性能参数

  • 容值:22 µF
  • 精度:±10%(K)
  • 额定电压:10 V DC
  • 温度特性:X5R(工作温度范围 -55℃ ~ +85℃,在该温度范围内电容变化通常限制在规定幅度内)
  • 封装:0805(2012 公制尺寸约 2.0 × 1.25 mm)
  • 典型用途:电源去耦、输出滤波、旁路与能量缓冲

注:X5R 属类 2 陶瓷,具有较高的体积电容密度但温度与电压依赖性较明显,应在设计中加以考虑。

三、适用场景

  • PCB 电源去耦:CPU、FPGA、模拟前端附近的中低频去耦与旁路;
  • DC-DC 转换器输出滤波:配合低 ESR 电感稳定输出;
  • 移动与便携设备:在空间受限时提供较大容量的局部储能;
  • 工业电子与家电:对温度稳定性要求不严的滤波与旁路电路。

四、设计与选用要点

  • DC 偏压影响:大容量陶瓷电容在施加直流偏压时电容值会下降,10 V 额定下实际施压环境(如接近额定电压)会显著降低有效容量,设计时应留有裕量并在实际工作电压下验证有效电容。
  • 温度依赖性:X5R 在高低温时电容会变化,若电路对电容量精度有严格要求,应考虑并联或选用温度特性更好的介质(如 C0G/NP0)。
  • 老化与稳定性:类 2 陶瓷存在随时间的老化现象,长期稳定性不如 NP0/C0G,需在产品寿命评估时一并考虑。
  • 布局建议:尽量将去耦电容靠近 IC 电源引脚放置,最短回流路径,避免在走线中产生额外寄生感抗。

五、可靠性与焊接建议

  • 推荐采用标准回流焊工艺;遵循厂方回流曲线与最大峰值温度限制;
  • 尽量避免多次高温回流后再大幅机械应力(边缘弯曲或钳夹),以降低裂纹风险;
  • 贴装时遵循 IPC/JEDEC 推荐焊盘与过孔布局,必要时配置足够的焊盘金属化面积与沉孔管理散热。

六、封装与采购信息

该型号常以卷带(Tape & Reel)形式供货,适配自动贴片机。常见购买渠道为代理与分销商,订购时请确认包装数量、检验报告与实际电气表征(尤其是在目标电压下的有效电容曲线),以保证设计一致性与量产稳定性。

(备注)选型时如需更高温度稳定性、更低偏压依赖或更严格的容量公差,可与 HRE(芯声)或分销商沟通替代型号或样品测试安排。

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