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HRE CGA0603X7R222K500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R222K500JT
- Type
- 0603
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R222K500JT
- Electronic Component
- 1
- Electronic Component
- 2.2nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495110
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R222K500JT 产品概述
一、概述
CGA0603X7R222K500JT 是一款贴片多层陶瓷电容（MLCC），标称容值 2.2nF（222），公差 ±10%（K），额定电压 50V，介质型式 X7R，封装规格 0603（1608公制）。品牌：HRE（芯声）。该型号在体积小、频率响应良好和可靠性要求中常被采用，适合各种消费电子、工业与通信应用中的旁路、耦合与滤波用途。
二、电气与温度特性
- 容值：2.2nF ±10%（标称25°C）
- 额定电压：50V DC
- 温度系数（介质）：X7R（工作温度范围 −55°C 至 +125°C，典型容值变化不超过 ±15%）
- 高频特性：MLCC 本征 ESR/ESL 低，适合高频旁路与去耦 说明：X7R 提供在宽温区间的稳定性，但并非 NP0/C0G 的超线性补偿，不能用于精准时间常数电路。
三、主要应用场景
- 电源去耦与旁路（IC、电源管理芯片附近）
- 滤波与去噪（模拟前端、信号链）
- 耦合与旁路电容（交流耦合、旁路地）
- 工业与消费类电子中对体积与容量比有要求的地方
四、封装与 PCB 设计建议
- 0603 小型封装适合高密度布板，放置时应尽量靠近器件电源引脚以减少寄生电感与走线阻抗。
- 建议使用短且宽的引线、尽可能直接返回地的铺铜与过孔，优化去耦效果。
- 焊接工艺遵循常规无铅回流曲线（参考 IPC/J-STD-020）。注意回流加热速率与最高温度限制。
五、可靠性与处理注意
- MLCC 对机械应力敏感，板弯曲或拆装时可能发生裂纹，焊接与清洗工艺要避免冷却时产生过大热应力。
- 储存应防潮、防静电，开封后按供应商建议的湿敏等级（MSL）管理。
- 测试项目通常包含电容容值与容差、电气绝缘、耐压（Vn/短时耐压）、焊接可靠性与热循环试验。
六、选型与替代
- 若需要更小温度漂移，可选 NP0/C0G；若需更高电压或更大电容，可考虑不同封装（0402、0805）或堆叠技术。
- 型号解析：CGA0603 表示 0603 封装，X7R 表示介质特性，222 表示 2.2nF，K 为 ±10%，500 代表 50V，JT 为包装/工艺代号（具体含义以厂方资料为准）。
总结：CGA0603X7R222K500JT 以其小尺寸、良好的频率特性和 50V 电压等级，适合在高密度电路板中作通用去耦与滤波使用。选型时结合温度稳定性、耐压与机械应力要求，按推荐的 PCB 布局与焊接工艺，可以获得稳定可靠的性能。若需完整规格书与可靠性数据，请参考 HRE（芯声）官方资料或联系供应商获取检验报告。
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