WMSIC Electronic Components

HXY MOSFET SI2318

ModelSI2318
PackageSOT-23
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET SI2318
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
SI2318
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
Electronic Component
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0227225452
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.56W
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2318 产品概述

一、产品简介

SI2318 是华轩阳(HXY)出品的一款小封装 N 沟道场效应管,漏源耐压 40V,连续漏极电流 5A,单片封装 SOT-23。器件定位为低压中等功率开关,适用于便携电子、负载开关与低压转换电路等需体积小、效率要求适中的场合。

二、主要电气参数

  • 漏源电压 Vdss:40V
  • 连续漏极电流 Id:5A
  • 导通电阻 RDS(on):52mΩ @ Vgs=4.5V, Id=4A;典型 38mΩ @ Vgs=10V
  • 阈值电压 Vgs(th):约 2V
  • 耗散功率 Pd:1.56W(SOT-23 包装下,需注意 PCB 散热设计)
  • 总栅极电荷 Qg:5.8nC @ Vgs=20V(门极驱动需求参考)
  • 输入电容 Ciss:340pF @20V;反向传输电容 Crss:30pF @20V
  • 工作温度范围:-55℃ ~ +150℃

三、器件特点与优势

  • 低导通损耗:在充分门极驱动(接近 10V)下 RDS(on) 可降至约 38mΩ,适合开关导通损耗敏感的应用。
  • 逻辑电平兼容:4.5V 驱动仍能获得较低的 RDS(on)(52mΩ),利于多数微控制器直接驱动(需评估实际电流与温升)。
  • 体积小、成本低:SOT-23 封装适合空间受限的消费类及工业控制板。

四、应用建议

  • DC-DC 降压转换器的高侧/低侧开关(需评估开关频率与损耗)。
  • 电源管理与负载开关(电流在几安培量级、开关频率不极端)。
  • 电池保护、便携设备供电切换、马达驱动的小功率段。

五、设计注意事项

  • SOT-23 的热阻较大,Pd 标称 1.56W 在无额外散热条件下达不到长期稳定输出,建议在 PCB 上使用加大铜箔散热、短输入/输出走线并考虑热沉过孔。
  • 开关损耗与栅极电荷相关:Qg=5.8nC 在高频开关时需选足够驱动能力的门极驱动器以降低切换损耗与热升。
  • 若系统门极仅由 3.3V MCU 驱动,注意 RDS(on) 会比 4.5V 情况显著增加,应验证导通损耗和温升是否可接受。
  • 关断时注意 Crss 与漏-栅耦合带来的电压尖峰,必要时加 RC 吸收或栅极电阻抑制振铃。

六、采购与替代

SI2318 由华轩阳电子提供,适合追求性价比和体积受限场合的设计。选型时可与其它同类 40V、SOT-23 封装且在 30~100mΩ 级别 RDS(on) 的 N 沟道 MOSFET 对比,重点关注实际 RDS(on) 标称条件、Qg 与封装热性能,以匹配系统驱动与散热能力。

如需样片、封装图或更详细的电气特性曲线,建议向供应商索取数据手册并在实际电路中做功率与热仿真验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.