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HXY MOSFET SS14L
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET SS14L
- Type
- HXY MOSFET
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- SS14L
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0257671789
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 200uA@40V
- Electronic Component
- 65℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS14L 产品概述
一、产品简介
SS14L（品牌：HXY MOSFET / 华轩阳电子）为一款面向消费电子和功率管理的独立式肖特基整流二极管。器件以 SOD-123FL 低剖面封装提供，适用于空间受限的表面贴装应用。其额定直流反向耐压为 40V，持续整流电流 1A，单脉冲非重复峰值浪涌电流（Ifsm）可达 30A，兼顾日常稳态整流与瞬态浪涌能力。
二、主要电气参数
- 类型：肖特基整流二极管（常见 SS14 系列特性）
- 直流反向耐压 Vr：40V
- 额定整流电流 If(DC)：1A
- 非重复峰值浪涌电流 Ifsm：30A（单次浪涌能力，受脉冲宽度和热条件影响）
- 低正向压降：在 1A 工作点时正向压降较传统硅整流低，典型值约在 0.4–0.6V 范围（与温度和批次相关）
- 反向漏电：肖特基器件在高温下反向漏电增大，应根据实际工况评估
三、封装与热性能
SOD-123FL 封装特点是体积小、厚度低、适合高密度 PCB 布局。该封装导热依赖焊盘和 PCB 铜箔面积，器件的允许连续电流受 PCB 热阻影响明显。使用时建议在器件焊盘处增加铜厚与散热面积，以改善热性能并提高长期可靠性。
四、典型应用场景
- 低压开关电源、整流与续流保护
- 逆向保护（电池防反接）与电源路径选择
- USB/移动设备、充电器与适配器中的输入整流
- LED 驱动与小功率 DC-DC 转换器的输出整流
- 开关器件的钳位、瞬态吸收与浪涌限流场合
五、选型与使用要点
- 若工作电流长期接近 1A，应评估 PCB 散热能力并采取降额（derating）；环境温度升高时须进一步降额。
- 对浪涌能力有严格要求的场合，注意 Ifsm 是单次峰值指标，重复脉冲和温升会降低有效寿命。
- 肖特基二极管反向漏电随温度快速上升，若工作在高温或高阻抗回路中需关注漏电对系统的影响。
- 布局建议将二极管尽量靠近电源源头，减小回路电感与寄生阻抗，必要时并联多只器件以分担热量和电流（需留意均流问题）。
六、可靠性与测试建议
- 建议在样品验证阶段进行正向压降（Vf@1A）、反向漏电（Vr、不同温度下）与浪涌试验（符合 Ifsm 条件）等测试。
- 进行热循环、温度升降与焊接可靠性试验以验证封装及焊点稳定性。
- 注意对潮湿敏感度（MSL）和推荐回流焊温度曲线的厂方说明，避免漂移或焊接缺陷。
七、采购与替代件建议
SS14L 在功能上与常见 SS14 系列兼容，购买时核对封装（SOD-123FL）、最大反向电压和浪涌规格以确保互换性。大量采购或用于关键应用，建议向华轩阳电子索取完整规格书和放样确认，必要时做长期可靠性跟踪。
总结：SS14L 以其低正向压降、小型封装和良好瞬态浪涌能力，适合多种小功率整流与保护场合。合理的 PCB 散热设计和热工艺控制是发挥其性能与延长寿命的关键。
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