WMSIC Electronic Components

HXY MOSFET HT7530S

ModelHT7530S
PackageSOT-23(TO-236)
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET HT7530S
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
100mV@(1mA)
Electronic Component
HXY MOSFET
Electronic Component
HT7530S
Electronic Component
1
Package
SOT-23(TO-236)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0257710935
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
30V
Output
Electronic Component
Output Voltage
3V
Output Current
100mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HT7530S 产品概述

一、产品简介

HT7530S 是华轩阳电子(HXY MOSFET)推出的一款固定输出线性稳压器(LDO),采用小巧的 SOT-23(TO-236)封装,面向低功耗、小体积的电源管理场景。该器件输入耐压可达 30V,输出为正极固定 3.0V,最大输出电流 100mA,静态电流仅 3μA,适合对静态功耗敏感的电池供电或待机设备。

二、主要特性

  • 输出类型:固定,正极输出 3.0V
  • 最大工作电压(输入):30V
  • 最大输出电流:100mA(单通道)
  • 压差示例:100mV @ 1mA(低电流时压差很小;高电流时压差会升高,详见器件曲线)
  • 静态电流(Iq):3μA,适用于低功耗和待机场景
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 封装:SOT-23(TO-236),体积小、便于贴片装配

三、典型电气与电路说明

  • 输入/输出去耦:为保证稳压器稳定工作与瞬态响应,建议在输入端和输出端各放置低 ESR 陶瓷电容(如 X5R/X7R)。典型值可选 1μF~10μF,并将电容紧靠引脚布局。
  • 压降与效率:数据给出 100mV@1mA 的压差,但压差随输出电流增加而上升。在高 Vin 与高 Iout 条件下,线性器件的功耗 Pd = (Vin - Vout) × Iout 会显著增加,应关注器件温升。
  • 热管理提示:SOT-23 封装散热能力有限。若输入接近 30V 且输出 3V、Iout 达到 100mA,则在最大电压差下功耗可能高达数瓦,超出小封装散热能力。推荐减小输入与输出差、限制最大负载电流,或在需要大功率时改用更大封装或前置开关稳压转换以降低功耗。

典型外接电路(文字示意): Vin —— CIN —— IN(HT7530S)
OUT(HT7530S) —— COUT —— Vout(3.0V)
GND ————— GND

四、应用场景

  • 低功耗传感器、无线节点(IoT)、遥测模块
  • 电池供电设备、手持终端、便携医疗仪器
  • 实时时钟(RTC)、微控制器供电、模拟前端偏置电源
  • 需要小封装、低静态电流与中等电流供电的场合

五、选型与使用建议

  • 如果系统经常在高输入电压与高输出电流同时工作,应评估封装热耗散能力并考虑使用前级开关降压或更高功率封装。
  • 输出电容选型以确保稳定性,优先低 ESR 陶瓷电容;实际应用中请参考厂方完整规格书以获取关于 ESR 与最小电容值的要求。
  • 布局建议:输入电容和输出电容尽量靠近器件引脚,地线短且粗,减少噪声与损耗。
  • 在可信赖性或关键应用里,使用前请参照华轩阳电子的完整数据手册确认管脚定义、电气特性曲线与热特性。

六、封装与采购

  • 封装:SOT-23(TO-236),适合自动贴装与小型化产品设计。
  • 品牌:HXY MOSFET(华轩阳电子),型号 HT7530S。采购与批量使用前建议向厂家或授权分销商索取最新数据表与样片验证。

如需更详细的管脚定义、电气特性曲线、典型应用电路图或热阻/波形图,请提供是否需要我帮您查阅并整理完整数据手册要点。

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