Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HXY MOSFET HBZT52C247F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET HBZT52C247F
- Type
- HXY MOSFET
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- HBZT52C247F
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- (Zzk)
- 66.5Ω
- (Zzt)
- 23.7Ω
- Electronic Component
- BM0263438774
- Diode
- 1
- Current(Ir)
- 1uA@17V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 22.8V~25.2V
- Electronic Component
- 40℃~+125℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HBZT52C247F 产品概述
一、产品简介
HBZT52C247F 是华轩阳电子（HXY MOSFET）推出的一款独立式小功率稳压二极管，标称稳压值24V，封装为SOD-123。器件适用于空间受限的表面贴装设计，用作精简电源稳压、基准和过压保护等场合。
二、主要电气参数
- 稳压值（标称）：24V
- 稳压值范围：22.8V ～ 25.2V（±5%）
- 反向电流 Ir：1µA @ 17V
- 耗散功率 Pd：500mW（典型，25°C环境）
- 动态阻抗 Zzt：23.7Ω；拐点阻抗 Zzk：66.5Ω
- 工作结温范围：-40°C ～ +125°C
上述参数为典型/标称值，具体选型时请参考完整规格书的测试条件。
三、特性与优势
- 小型SOD-123封装，便于高密度表面贴装与自动化生产。
- ±5% 稳压精度可满足一般基准与保护用途。
- 低反向泄漏电流，有利于低功耗应用。
- 动态阻抗较低，在稳压区能提供较稳定的电压源。
四、典型应用场景
- 低功耗电源的并联稳压（分流稳压）或基准电压源。
- 工业控制与通信设备中的过压钳位与浪涌吸收。
- 仪表放大器与电平参考电路。
- 消耗小、体积受限的便携设备保护电路。
五、封装与热管理
SOD-123 为小型塑封，热阻相对较高。器件额定耗散500mW通常是在环境温度25°C下给定，建议随环境温度线性降额至125°C（常见做法）：每升高1°C额定功耗约降低5mW。实际设计中应留有裕量，必要时通过 PCB 铜箔热沉或改用更大功率器件以保证可靠性。
六、应用要点与选型建议
- 计算稳压电路时确认稳压电流处于器件给定的测试/稳压区间，以保证稳压值和动态阻抗指标满足要求。
- 注意耗散功率和环境温度的降额，尽量避免长时间在额定Pd下工作。
- 若需更精密基准或更大功率，请选择容差更小或功率更高的器件。
- 对浪涌或高频干扰敏感的场合，配合限流电阻或抑制电容使用以改善响应。
七、结语
HBZT52C247F 为一款面向通用场景的24V稳压二极管，凭借小巧封装与稳定的电气特性，适合成本敏感且空间受限的稳压与保护应用。在实际设计中应重点关注功耗降额与热管理，确保在目标工况下长期可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
