WMSIC Electronic Components

HXY MOSFET 2SK3018W

Model2SK3018W
PackageSOT-323
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET 2SK3018W
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
2SK3018W
Electronic Component
1
Package
SOT-323
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
Electronic Component
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0263449393
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SK3018W 产品概述

一、产品简介

2SK3018W 是一款小功率 N 沟增强型场效应管(MOSFET),由华轩阳电子(HXY MOSFET)提供,采用 SOT-323 表面贴装封装。该器件设计用于低电压、低电流的开关和放大应用,典型参数包括额定漏源电压 30V、连续漏极电流 100mA、以及在 VGS=10V 时 RDS(on) 为 1.5Ω。器件体积小、输入电容低,适合便携式和空间受限的电路板布局。

二、主要电气参数

  • 类型:N 沟增强型 MOSFET(独立式)
  • 数量:1 个 N 沟道
  • 漏源电压 Vdss:30 V
  • 连续漏极电流 Id:100 mA
  • 导通电阻 RDS(on):1.5 Ω @ VGS = 10 V
  • 耗散功率 Pd:350 mW
  • 阈值电压 VGS(th):1.5 V(典型或最大)
  • 输入电容 Ciss:13 pF
  • 输出电容 Coss:9 pF
  • 反向传输电容 Crss:4 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-323(适合表面贴装工艺)

以上参数反映了器件在低功耗、小信号开关场景下的特性。特别是较低的寄生电容(Ciss、Coss、Crss)有利于高频切换时降低开关损耗和提高响应速度。

三、特性与优势

  • 小尺寸封装:SOT-323 有利于高密度 PCB 布局和表面贴装自动化生产。
  • 低门极输入电容:Ciss 仅 13 pF,驱动电荷小,适用于对驱动功率敏感的系统。
  • 低功耗应用适配:Pd=350 mW,适合小电流负载的开关或保护电路。
  • 宽温度范围:-55 ℃ 至 +150 ℃,满足工业级环境下的可靠性需求。
  • 30V 的耐压能力适合中低压供电系统,如 12V 或 24V 轻载控制场合。

四、典型应用场景

  • 便携式设备的电源开关与负载切换(低电流子系统)
  • 通信设备的模拟开关或隔离电路
  • 电池保护和管理中的低电流断路/旁路
  • 传感器接口电路、微控制器驱动的小信号开关
  • LED 驱动器中小功率通断控制(需考虑导通损耗)

五、设计与使用注意事项

  • 导通电阻说明在 VGS = 10 V 时测得,若在较低 VGS(例如 3.3 V 或 5 V)下使用,应注意 RDS(on) 可能显著增加,导致更高的功耗和温升。为降低导通损耗,建议在可能时提供充分的栅极驱动电压。
  • 功耗与散热:器件 Pd 为 350 mW,SOT-323 的热阻相对较高,实际允许的耗散受 PCB 熔铜面积和环境温度影响,应在电路设计中保证器件结温不超过许可范围。
  • 开关速度与寄生电容:Ciss、Coss、Crss 值较低,有助于提高开关速度,但在高频应用中仍需评估电磁干扰(EMI)并采取合适的滤波或缓启动设计。
  • ESD 与静电防护:MOSFET 对静电敏感,建议在生产、测试和装配过程中采取静电防护措施(如接地腕带、离子风机等)。
  • 引脚识别与焊接工艺:SOT-323 是小封装,焊接时应控制回流曲线与焊接温度,避免过热损伤器件。

六、封装与采购信息

  • 封装形式:SOT-323(小型表面贴装封装)
  • 品牌:HXY MOSFET(华轩阳电子)
  • 型号:2SK3018W
  • 建议在采购时确认包装形式(散装、带卷盘)、批次完整性与原厂出厂测试报告,必要时索取器件数据手册以核对引脚定义与典型特性曲线。

七、总结

2SK3018W 是一款面向低功率、小信号应用的 N 沟道 MOSFET,具有 30V 耐压、100mA 电流能力以及低寄生电容的特点,适合在便携设备、电源管理及信号开关等场合中作为开关元件使用。在电路设计中应结合栅极驱动电压、散热条件与工作频率等因素进行评估,以保证器件的稳定性与可靠性。

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