Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HXY MOSFET 2SC2712
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET 2SC2712
- Type
- HXY MOSFET
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- 2SC2712
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0257671795
- Transistor Type
- NPN
- Frequency(f T)
- 80MHz
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 150mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2SC2712 产品概述
一、概述
2SC2712 是一款由 HXY MOSFET（华轩阳电子）提供的 NPN 小信号晶体管，封装为 SOT-23，针对便携式和空间受限的电子产品设计。器件在低电流工作点下表现出较高的直流电流增益（hFE≈200@Ic=2mA, VCE=6V），并具备 50V 的集—射极击穿电压与 150mA 的集电极允许电流，适合作为低功耗放大和开关单元使用。
二、主要电气参数
- 晶体管类型：NPN（BJT）
- 集电极电流（IC）：最大 150mA
- 集-射击穿电压（Vceo）：50V
- 耗散功率（Pd，Ta=25°C）：150mW
- 直流电流增益（hFE）：≈200（Ic=2mA, VCE=6V）
- 特征频率（fT）：≈80MHz
- 集极截止电流（ICBO）：≈100nA
- 集—射饱和电压（VCE(sat)）：约 100mV（低饱和电压特性）
- 射—基击穿电压（Vebo）：5V
- 封装：SOT-23（小型表面贴装）
三、性能特点
- 高增益：在低电流工作点具有较高 hFE，便于实现低偏流电路的增幅需求。
- 高频性能良好：fT≈80MHz，适合音频至低频射频（VHF）级别的放大与缓冲。
- 低饱和电压：VCE(sat)约100mV，有利于开关应用中降低功耗与压降。
- 小型封装：SOT-23 适合高密度 PCB，便于自动化贴装与回流焊工艺。
四、典型应用场景
- 小信号放大器（前置放大、音频级增益单元）
- 开关电路与驱动（信号级开关、低侧/高侧驱动辅助）
- 电平转换与缓冲（高输入阻抗缓冲器、驱动后级 MOSFET 或继电器）
- 无线通信接收前端或中频放大（在 fT 范围内的射频电路）
五、使用与热管理建议
- 遵守额定值：长期工作时请将集电极电流和耗散功率留有裕量，避免持续接近最大额定值。
- 功率耗散：Pd=150mW（Ta=25°C）非常有限，布局时注意散热路径和周边铜箔面积以降低结温。
- 温度降额：在高环境温度下请按厂商数据手册进行功率降额计算，必要时采用外部散热措施或降低工作电流。
- 焊接工艺：SOT-23 兼容常规回流焊流程，具体焊接温度和时间以厂家推荐回流曲线为准。
六、封装与可靠性考虑
SOT-23 小型化封装便于移动设备与消费电子使用，但在手工焊接与检修时需注意引脚与热应力。引脚定义和具体参数请以 HXY 官方数据手册为准，设计前建议下载并参照完整器件规范进行电气与热仿真验证。
总结：2SC2712 在小功耗、小尺寸应用中提供了平衡的增益与频率特性，适合各类小信号放大与开关场景。选择与布局时应重视热管理与安全工作区以保证器件长期可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
