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HXY MOSFET LD1117-3.3
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET LD1117-3.3
- Type
- SOT-223
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 12mV@(1A)
- Electronic Component
- HXY MOSFET
- Electronic Component
- LD1117-3.3
- Electronic Component
- 1
- Package
- SOT-223
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.232g
- Electronic Component
- 1
- Electronic Component
- BM0257710933
- Operating Temperature
- 0℃~+125℃
- Operating Voltage
- 15V
- Output
- Electronic Component
- Output Voltage
- 3.3V
- Output Current
- 1A
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LD1117-3.3 产品概述
一、产品简介
LD1117-3.3 是一款固定输出 3.3V 的线性低压差稳压器（LDO），由 HXY MOSFET（华轩阳电子）提供 SOT-223 封装版本。器件支持最高工作电压 15V、最大输出电流 1A，适用于对输出噪声、纹波要求较高且输出电压固定为 3.3V 的电源设计。
二、主要参数
- 输出类型：固定 3.3V（正极输出）
- 最大输入电压：15V
- 最大输出电流：1A
- 压差（dropout）：12mV @ 1A（出厂数据）
- 静态电流（Iq）：12mA
- 工作温度：0℃ ~ +125℃
- 保护功能：过流保护（OCP）、过热保护（OTP）
- 输出通道数：1，封装：SOT-223
三、特色与保护功能
器件集成过流保护与过热保护，能在短路或过载条件下限制输出电流并在结温过高时关断或限制输出以防止损坏。静态电流 12mA 在持续供电或电池供电应用中需考虑待机功耗影响。
四、封装与引脚说明
封装为 SOT-223，便于通用 PCB 安装与散热。典型引脚排列（面向引脚方向）为：1 - GND，2 - VOUT，3 - VIN；散热片/Tab 通常与 VIN 相连，便于通过大铜箔或散热垫导出热量。
五、典型应用场景
适用于通信模块、单片机供电、传感器电源以及需低噪声 3.3V 电源的小型工业与消费电子设备。对大电流且输入电压远高于 3.3V 的应用需格外注意热设计。
六、设计与热管理建议
- 输入/输出去耦：建议在输入端和输出端各放置 10µF（低 ESR）电容，输出端可并联 0.1µF 陶瓷以抑制高频噪声；电容应靠近管脚。
- 功率耗散：当 Vin=15V、Iout=1A 时，器件功耗约为 (15−3.3)×1A = 11.7W，SOT-223 单片在无良好散热的 PCB 上无法安全散热，应通过扩大散热铜箔、加导热垫或换用更低压降/开关电源方案。
- 温升计算：在设计时按实际 PCB θJA 估算结温，保证工作温度范围内，并为过热保护预留裕量。
- 电流与纹波：Iq=12mA 在低功耗场景需评估待机耗电；若对纹波极其敏感，考虑后端滤波或 LDO 前使用开关稳压后继降压以减少功耗与发热。
七、选型与替代建议
若系统输入与输出差压大且输出电流接近 1A，优先考虑开关降压转换器以提高效率并降低热量。若必须使用线性器件，可选用具有更低静态电流或更大功率散热能力的封装（如 DPAK/TO-220）作为替代。
备注：本文基于您提供的器件参数整理，在实际设计前建议参阅 HXY MOSFET 的完整数据手册以获取精确的特性曲线、热阻和典型应用电路。
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