WMSIC Electronic Components

HXY MOSFET HTLP521GB-S

ModelHTLP521GB-S
PackageSMD-4P
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET HTLP521GB-S
Type
HXY MOSFET
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
HTLP521GB-S
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.305g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0257710921
Operating Temperature
0℃~+70℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HTLP521GB-S 产品概述

一、产品简介

HTLP521GB-S 是华轩阳电子(HXY MOSFET)推出的一款DC 输入、光电三极管输出的晶体管型光耦合器,采用 SMD-4P 封装。该器件以高隔离电压、宽电流传输比(CTR)及较大的输出电流能力为特点,适合对信号隔离、低频开关和电平移位有要求的电子系统。

二、主要特性

  • 输入侧:LED 最大正向电流 If = 50 mA,典型正向压降 Vf ≈ 1.15 V(受 If 与温度影响)。直流反向耐压 Vr = 6 V,禁止长时间反向加压。
  • 输出侧:光电三极管最大集电电流 Ic 可达 50 mA,允许的负载电压最高 80 V。集-射极饱和电压 VCE(sat) ≈ 250 mV(指定条件下 2 mA、5 mA)。
  • 隔离与可靠性:工作绝缘电压 Vrms = 5 kV(耐压测试级别)。总功耗 Pd = 200 mW,工作温度范围 0 ℃ ~ +70 ℃。
  • 动态特性:上升时间 tr ≈ 2 μs,下降时间 tf ≈ 3 μs,适合低至中等速率信号隔离。
  • 电流传输比:CTR 范围 100% ~ 600%,实际 CTR 随 If、温度和测量条件变化较大,应在电路设计中预留裕量。

三、典型应用场景

  • MCU 与高压/噪声侧之间的电气隔离与信号传输。
  • 开关电源的次级反馈、检测与保护信号隔离。
  • 工业控制与家电的状态检测、限位与传感器隔离。
  • 小功率继电驱动、指示及逻辑电平转换(注意功耗与电压限制)。

四、设计注意事项

  1. 功率与电压限制:器件总耗散 Pd = 200 mW,若输出电流接近 50 mA,则允许的 VCE 极低(Pd/IC ≈ 4 V),因此在高压负载(接近 80 V)下必须用限流或外部开关器件,否则将超出功耗限制。
  2. CTR 可变:CTR 在 100%~600% 之间波动,电路设计时建议按最低 CTR(或更低安全裕量)计算所需 LED 驱动电流,保证在最不利条件下仍满足输出电流要求。
  3. 输入保护:LED 反向耐压仅 6 V,应避免反向电压;推荐在输入端并联反向保护二极管或限流电阻。
  4. 热管理与封装:SMD-4P 封装有利于 PCB 布局,但注意焊盘与散热路径,避免长期高 If 或高 Ic 下累积热量导致性能退化。
  5. 工作环境:器件标称工作温度 0~+70 ℃,若需工业级宽温应用,需选用相应等级的器件或加温度保护。

五、典型电路提示

  • 低电平侧驱动:若使用 5 V MCU 驱动,按最小 CTR=100% 估算,为获得 Ic=2 mA,理论上 If≈2 mA;考虑到安全裕量,建议 If 取 3~5 mA,串联限流电阻 R = (Vdrv - Vf)/If。
  • 高压测量/告警:输出端建议使用上拉电阻或外部晶体管/MOSFET 做电平转换,确保负载电压与器件 Pd 的匹配。

HTLP521GB-S 以高隔离、宽 CTR 与小体积封装为优势,适合各类需要可靠隔离与中等功率输出的电子设计。设计时请结合实际工作点校核热耗与电气应力,确保长期稳定运行。

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