WMSIC Electronic Components

HXY MOSFET 2N2222A

Model2N2222A
PackageTO-92
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET 2N2222A
Type
HXY MOSFET
Minimum package
1000 袋装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
2N2222A
Electronic Component
1
Package
TO-92
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.177g
Electronic Component
1
Electronic Component
BM0258661710
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
625mW
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2N2222A 产品概述 — HXY MOSFET(华轩阳电子) TO-92 封装

一、概述

2N2222A 是一款通用型 NPN 双极结晶体管,适合开关与放大场合。由 HXY MOSFET(华轩阳电子)提供的该型号以 TO-92 塑料封装供应,具有 600mA 的集电极电流能力、40V 的集电极-射极击穿电压及较高的频率特性(fT≈300MHz),在小体积、高性价比场合表现稳定可靠,常见于中小功率驱动、电平转换和高速开关电路。

二、主要参数

  • 晶体管类型:NPN(BJT)
  • 最大集电极电流 Ic:600 mA
  • 集-射击穿电压 Vceo:40 V
  • 额定耗散功率 Pd(TO-92,常温):625 mW
  • 直流电流增益 hFE:约 300(测量条件:Ic=150 mA,Vce=10 V)
  • 特征频率 fT:300 MHz(适合快速开关)
  • 集电极截止电流 Icbo:≈10 nA(室温)
  • 集-射饱和电压 VCE(sat):约 600 mV(在大电流工况,如 IC≈500 mA 时测得;低电流时更低)
  • 射-基击穿电压 Vebo:6 V
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 封装:TO-92;数量:1 只

三、特点与优势

  • 高频特性良好:fT ≈ 300 MHz,适用于需要快速开关或射频前级的应用。
  • 高增益:在中等大电流条件下 hFE 可达 ~300,有利于减小基极驱动功率。
  • 低漏电流:Icbo 约 10 nA,便于在高阻抗或待机电路中维持低泄漏。
  • 工艺成熟、成本低:TO-92 小型封装便于手工焊接与快速原型开发。
  • 宽温度范围:满足工业级温度要求,适用性强。

四、典型应用

  • 直流/脉冲开关:继电器、继电器驱动、小电流电机驱动。
  • 放大器:小信号放大、前置放大器、模拟电路增益级。
  • 电平转换与缓冲:逻辑信号接口、电流放大与驱动。
  • 高速开关电路与脉冲形成:由于频率响应好,可用于MHz级别的开关场合。
  • 通用电子教学与原型设计:常用于实验板与教育演示。

五、使用建议与注意事项

  • 热管理:TO-92 封装的耗散功率有限(Pd≈625 mW),在高 Ic 或连续工作时应注意散热与限流,必要时降低占空比或改用更大功耗封装。
  • 驱动设计:尽管 hFE 在中高电流时较高,切勿在饱和区盲目依赖高增益;驱动基极时建议按所需 IC 和所需 VCE(sat) 配置合适的基极电流(一般 IB ≈ IC/10 或根据饱和要求调整)。
  • 极限电压与反向保护:Vebo≈6 V,基射间反向电压较低,避免对基射施加较大反向电压;电路中可加限流或反向保护二极管。
  • 引脚核实:TO-92 的引脚排列因厂商略有差异,常见平面朝前时自左至右为 E-B-C,但请以 HXY 产品数据手册为准再接线。

六、封装与采购信息

  • 封装形式:TO-92 塑料直插,适合手工焊接与直插 PCB。
  • 品牌:HXY MOSFET(华轩阳电子)。
  • 建议在采购与设计阶段参照厂方完整数据手册确认具体引脚排列、热阻参数与典型曲线,以确保电路可靠性。

总结:HXY 出品的 2N2222A(TO-92)在小功率开关与中频放大场合表现均衡,兼具较高增益与良好频率响应,是实验、教学及轻负载工业应用的常用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.