WMSIC Electronic Components

HCI CO32H4-25.000-33JDTSN CO32H4

ModelCO32H4-25.000-33JDTSN
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI CO32H4-25.000-33JDTSN
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
CO32H4-25.000-33JDTSN
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.046g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0263576899
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Operating Current
10mA
Electronic Component
±10ppm
Output
HCMOS
Frequency
±15ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CO32H4-25.000-33JDTSN 产品概述

一、产品简介

CO32H4-25.000-33JDTSN 是杭晶(HCI)面向工业级应用推出的一款高精度晶振器。工作频率为 25.000 MHz,输出采用 HCMOS 兼容电平,采用 3.2×2.5 mm(3225)四脚贴片封装,支持 1.8 V 至 3.3 V 宽电压供电范围,适配多种低压数字电路。器件以高稳定性与高可靠性为设计目标,适合通信、工业控制、计量与消费电子等对频率精度有较高要求的应用场景。

二、主要规格参数

  • 品牌:HCI(杭晶)
  • 型号:CO32H4-25.000-33JDTSN(型号升级变更为 1532H-25.000K33DTSL)
  • 频率:25.000 MHz
  • 输出模式:HCMOS
  • 工作电压:1.8 V ~ 3.3 V
  • 工作电流:典型 10 mA
  • 常温频差(初始容差):±10 ppm
  • 频率稳定度(含温度及工艺等影响):±15 ppm
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD 3225-4P(贴片)

三、产品特性与优势

  • 高精度:常温频差仅 ±10 ppm,能满足对定时精度要求严格的系统设计。
  • 宽电压兼容:1.8 V 到 3.3 V 的工作电压覆盖主流低压逻辑,便于在多种平台上直接替换使用。
  • 工业级温度范围:-40 ℃ 至 +85 ℃,适应工业与室外环境的温度变化。
  • 稳定可靠:整体频率稳定度控制在 ±15 ppm 范围,适合对长期漂移和环境敏感的应用。
  • 小尺寸封装:3225 小型化封装,利于高密度 PCB 布局与自动化贴装生产。

四、典型应用场景

  • 通信设备(网络同步、时钟恢复)
  • 工业控制与自动化(PLC、运动控制器)
  • 精密测量与测试仪器
  • 嵌入式系统与物联网终端
  • 消费电子中对定时精度有要求的子系统

五、选型与替换建议

CO32H4-25.000-33JDTSN 已升级变更为型号 1532H-25.000K33DTSL。建议在新批次采购时以升级型号为准,升级型号在电气与封装兼容性方面保持一致性,请在设计确认或批量替换前与供应商核对引脚定义与机械图纸。若需更宽温域或特殊可靠性认证(如汽车 AEC-Q100),请提前与 HCI 技术支持沟通确认。

六、封装与安装注意

  • 封装类型:SMD3225-4P,支持标准贴片回流焊工艺。
  • 建议按照厂商提供的 PCB 封装库与焊盘尺寸进行设计,以保证可靠的焊接性与热性能。
  • 避免将敏感的时钟线路与高频开关电源或大电流回流路径平行布线,以减少干扰对时钟抖动的影响。

如需详细数据手册(包含电气特性曲线、时序、引脚定义、机械尺寸与回流曲线等),建议向 HCI(杭晶)或授权代理商索取最新版本产品资料以便完成硬件设计与可靠性验证。

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