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HCI 0132M4-8.000F22DTNL 0132M4
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 0132M4-8.000F22DTNL
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 0132M4-8.000F22DTNL
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.417g
- Frequency
- 8MHz
- Electronic Component
- 1
- Electronic Component
- BM0264340509
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 22pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0132M4-8.000F22DTNL 产品概述
一、产品简介
0132M4-8.000F22DTNL 是杭晶（HCI）全国产化贴片金属晶振，采用 SMD3225-4P 封装（3.2×2.5mm，4 脚），标称频率 8.000 MHz。器件面向工业级应用，工作温度范围 -40℃ 至 +85℃，常温频差 ±10 ppm，频率稳定度 ±20 ppm，负载电容 22 pF，等效串联电阻（ESR）100 Ω。该晶振以国产化供应链为优势，适合对可靠性和成本敏感的批量生产场景。
二、主要特点
- 小尺寸贴片封装（SMD3225-4P），适合高密度 PCB 布局
- 金属外壳，抗振性能良好、长期稳定性高
- 工业级温度范围（-40℃ ~ +85℃），适应多种环境
- 常温频差 ±10 ppm，满足中高精度时钟需求
- 指定负载电容 22 pF，便于与 MCU/ASIC 等时钟电路配合
三、典型技术参数
- 型号：0132M4-8.000F22DTNL
- 频率：8.000 MHz
- 封装：SMD3225-4P（3225，4P）
- 负载电容：22 pF
- 常温频差：±10 ppm
- 频率稳定度（含温度影响）：±20 ppm
- 等效串联电阻（ESR）：100 Ω
- 工作温度：-40℃ ~ +85℃
- 制造：全国产化（杭晶 HCI）
四、应用场景
- 工业控制、嵌入式单片机系统时钟源
- 通信设备、无线模块的参考时钟
- 计时/测量仪器、物联网终端及消费类电子产品
- 需国产化供应链或对替代进口晶振有要求的项目
五、选型与布板建议
- 负载电容选取：若晶振标称 CL=22 pF，可按公式 C1=C2≈2×CL−Cstray 估算（Cstray 包括引脚与 PCB 寄生电容，通常取 2~5 pF），常见取值为 33 pF 左右两只。
- 布局：晶振与 MCU/振荡器引脚应尽量靠近，避免长走线；在晶振两侧接地平面，减少干扰。
- 焊接：遵循厂家回流焊工艺建议，避免超出推荐温度曲线以保证频率稳定性与可靠性。
- 电路中尽量避免在晶体附近布置大电流或高频噪声源，必要时加入屏蔽或滤波。
六、储存与贴装注意
- 储存环境保持干燥，避免潮湿和强酸碱气体腐蚀；建议在原包装内并在规定期限内使用。
- 贴装时遵循 ESD 防护要求，避免静电损伤；回流焊后建议进行功能验证（频率及启动时间检查）。
如需索取封装图纸、详细频率-温度曲线、等效电路或样品测试报告，可联系杭晶（HCI）或指定代理提供进一步资料。
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