WMSIC Electronic Components

HCI 0132M4-25000F13DTLJL 0132M4

Model0132M4-25000F13DTLJL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0132M4-25000F13DTLJL
Type
HCI
Minimum package
3000 卷盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0132M4-25000F13DTLJL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.052g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0264527065
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
13pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0132M4-25000F13DTLJL 产品概述

一、产品简介

0132M4-25000F13DTLJL 为杭州晶振(HCI/杭晶)推出的全国产化贴片金属晶体谐振器,封装为 SMD3225-4P。器件标称频率 25.000 MHz,适配各类数字系统时钟源和高稳定性频率参考。器件针对工业级工作温度范围设计,可在 -40℃ 至 +85℃ 下可靠工作,适合消费类与工业类产品的批量应用与国产替代方案。

二、主要规格与特性

  • 标称频率:25.000 MHz
  • 常温频差(Initial):±20 ppm
  • 频率稳定度(含温度、老化等参考):±30 ppm
  • 负载电容:13 pF
  • 等效串联电阻(ESR):60 Ω
  • 工作温度范围:-40℃ ~ +85℃
  • 封装:SMD 3225-4P(贴片金属封装)
  • 品牌:HCI(杭晶)
  • 全国产化,供应链可控,适合替代进口型号

三、应用场景

  • MCU/MPU 时钟源与系统参考时钟
  • 通信模块(射频基带/协议处理)
  • 工业控制与仪表设备
  • 网络设备、存储与接口芯片时钟
  • 需要中高精度、工业温度等级的电子产品

四、使用建议

  • 匹配电路:常见晶体振荡器(如 CMOS/CMOS-inverter)输入端需配对称负载电容,推荐典型负载电容值为两端各约 22 pF(计算时考虑焊盘与 PCB 寄生电容,一般采用标准值 22 pF 以匹配 13 pF 标称负载)。
  • 布局建议:晶体器件靠近 MCU/振荡器引脚布置,走线最短并避开高速信号干扰;保持晶体周围地平面连续,减少噪声耦合。
  • 焊接与可靠性:采用常规无铅回流焊工艺,按厂商推荐回流曲线及 PCB 设计规范执行;存储与装配过程中注意防潮与静电防护。

五、采购与品质保障

作为国内量产型号,HCI(杭晶)提供稳定产能与本地化技术支持,适合大批量替换与国产化要求项目。出货前进行频率与振幅筛选,满足工业级温度循环与老化测试要求。量产需求可与供应商沟通交期、测试报告及放行标准。

如需更详细的封装图、焊盘尺寸、回流曲线或申请样品,请联系杭晶官方渠道获取完整数据手册与应用指导。

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