WMSIC Electronic Components

HCI 3437S-32.768DT09LLL 3437S

Model3437S-32.768DT09LLL
PackageSMD7531-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 3437S-32.768DT09LLL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
3437S-32.768DT09LLL
Electronic Component
1
Package
SMD7531-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.264g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264982134
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
9pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3437S-32.768DT09LLL 产品概述

一、产品简介

3437S-32.768DT09LLL 是杭晶(HCI)推出的全国产化贴片石英晶振,工作频率 32.768 kHz,专为实时时钟(RTC)及低功耗定时应用设计。器件为两脚 SMD 结构,适配主流 MCU/RTC 晶体振荡器输入,稳定可靠,适合大规模 SMT 生产。

二、主要技术参数

  • 型号:3437S-32.768DT09LLL(品牌:HCI/杭晶)
  • 频率:32.768 kHz
  • 常温频差(25°C):±20 ppm
  • 频率稳定度(-40°C ~ +85°C):±20 ppm
  • 负载电容:9 pF
  • 等效串联电阻(ESR):≤ 65 kΩ
  • 工作温度范围:-40°C ~ +85°C
  • 封装:贴片 2 引脚(常见封装样式:3068,兼容 SMD7531-2P 等封装规格)
  • 全国产化,兼容 49S 系列封装替代方案

三、性能特点

  • 高频率精度高:常温±20 ppm 及温度范围内±20 ppm 的整体稳定性,满足大多数工业级 RTC 要求。
  • 低频低功耗:32.768 kHz 专用于时间基准,配合低功耗 MCU 可实现长待机寿命。
  • 兼容性强:9 pF 负载适配多数 MCU/RTC 内部振荡电路,ESR ≤65 kΩ 可被常见晶振驱动器接受。
  • 工业温度级:-40°C 至 +85°C,适用于工业与消费电子场景。

四、典型应用

  • 实时时钟(RTC)模块与单片机时间基准
  • 智能电表与计量设备
  • 可穿戴设备、健康监测终端与手持设备
  • 物联网节点、传感器与低功耗无线终端
  • 工业控制与仪器仪表时间同步

五、封装与贴装建议

  • 推荐采用标准 SMT 回流焊工艺,参照 IPC/JEDEC 回流曲线进行焊接,避免过高峰值温度与过长保温时段以防损伤晶体。
  • 负载电容匹配:目标 CL = 9 pF,考虑线路与封装寄生电容(约 2–3 pF),建议外接两侧电容值约 12–15 pF(以实际板上寄生值校准)。
  • 走线与布局:晶体附近应避免大功率信号线与高频干扰源,保证对称接地和最短引线以降低寄生干扰。
  • 防护:避免受机械应力、强酸碱清洗剂及过量机械振动,潮湿环境下建议密封或做好封装防潮。

六、品质与可靠性

  • 材料与生产全国产化,良率与批次可控,适合量产供货。
  • 建议在设计验证阶段进行温度循环、振动与寿命验证,以确保在目标应用环境下的长期稳定性。

如需器件交期、样品、封装尺寸图或与特定 MCU 的匹配建议,可提供具体型号与应用电路进一步确认。

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