WMSIC Electronic Components

HCI XC32M4-30.000-F16LJDTL XC32M4

ModelXC32M4-30.000-F16LJDTL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC32M4-30.000-F16LJDTL
Type
HCI
Minimum package
3000 卷盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC32M4-30.000-F16LJDTL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.029g
Frequency
30MHz
Electronic Component
1
Electronic Component
BM0264527033
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
16pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC32M4-30.000-F16LJDTL 贴片晶振产品概述

一、产品核心身份与基本定位

XC32M4-30.000-F16LJDTL是杭晶电子(HCI) 推出的一款工业级通用石英贴片晶振,采用SMD3225-4P小型封装,标称频率30MHz,专为需要稳定时钟信号的电子设备设计。作为国内主流晶振选型之一,其平衡了性能、成本与可靠性,适配多数中低端至中端应用场景的时钟同步需求,无需额外高精度校准即可满足常规设备要求。

二、关键性能参数详解

  1. 频率与精准度:标称频率30MHz,是电子设备中常见的时钟基准(适配多数MCU、FPGA、通信芯片的时钟输入范围);常温(25℃)频差±20ppm,意味着常温下实际频率偏差不超过30MHz×20×10⁻⁶=600Hz,满足工业控制、消费电子等场景对频率精度的基本要求。
  2. 负载电容匹配:标称负载电容16pF,是晶振振荡电路需严格匹配的核心参数——若电路负载电容(含PCB寄生电容)与16pF偏差超过±2pF,会导致实际振荡频率偏移,甚至无法起振。设计时需通过并联电容调整总容量至标称值。
  3. 等效串联电阻(ESR):最大40Ω,ESR是晶振内部损耗的关键指标,直接影响振荡幅度与稳定性:ESR越低,振荡越稳定、抗干扰能力越强。40Ω属于常规工业级晶振的合理范围,适配CMOS反相器、专用振荡电路等主流设计。
  4. 频率稳定度:总频率稳定度±30ppm,覆盖工作温度变化、电源波动等环境因素的影响(工作温度范围内频率偏差不超过30MHz×30×10⁻⁶=900Hz),确保设备在极端温度下仍能维持时钟同步。

三、封装与物理特性

采用SMD3225-4P贴片封装:

  • 尺寸:3.2mm×2.5mm(3225封装代号),4引脚设计,符合IPC标准;
  • 贴装工艺:无铅(RoHS compliant),适配SMT自动化贴装,生产效率高;
  • 空间优势:小型化封装节省PCB面积,适合便携式设备、高密度电路板(如路由器、智能家电主控板)。

四、典型应用场景

XC32M4-30.000-F16LJDTL的性能适配以下场景:

  1. 工业控制设备:PLC、变频器、传感器模块的时钟基准(-40~85℃温宽满足工业现场需求);
  2. 消费电子:智能家电(空调、洗衣机主控MCU)、便携式音箱的时钟同步;
  3. 通信设备:路由器、交换机、无线AP的时钟源(30MHz适配多数通信芯片的时钟输入);
  4. 车载辅助设备:行车记录仪、车载音响的时钟模块(需确认是否满足车载级严格标准,此款为工业级)。

五、环境适应性与可靠性

  1. 工作温度范围:-40℃~+85℃,覆盖工业级应用的典型温变(低温启动无异常,高温下频率稳定);
  2. 长期可靠性:石英晶振本身具有10年以上的长期稳定性,HCI产品经过老化筛选(通常24小时以上),失效率低;
  3. 抗干扰能力:40Ω ESR配合合理的振荡电路设计,可有效抵抗电磁干扰(EMI),适合复杂电磁环境(如工业厂房、通信机房)。

六、选型与替换注意事项

若需替换或选型:

  1. 核心参数匹配:需确认频率(30MHz)、负载电容(16pF)、封装(SMD3225-4P)完全一致;
  2. ESR参考:替换晶振的ESR建议不超过50Ω(避免振荡幅度不足导致系统误判);
  3. 温度范围适配:若应用场景温度超出-4085℃,需选择更高温宽的晶振(如-55125℃车载级);
  4. 电路验证:替换后需通过示波器测试振荡波形(幅度≥1Vpp为宜),确认频率偏差符合要求。

该产品以高性价比、稳定可靠的特点,成为工业控制、消费电子等领域的常规时钟源选型,无需额外定制即可满足多数场景需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.