WMSIC Electronic Components

HCI 0132M4-24.000F20DTNJL 0132M4

Model0132M4-24.000F20DTNJL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0132M4-24.000F20DTNJL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0132M4-24.000F20DTNJL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.042g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0264982133
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0132M4-24.000F20DTNJL 产品概述

一、产品简介

0132M4-24.000F20DTNJL 为全国产化贴片金属晶振,封装为 SMD 3225-4P(3.2×2.5mm,4 引脚),出厂品牌 HCI(杭晶)。标称频率 24.000 MHz,针对需要高可靠性、可批量国产化替代的应用场景设计,适配常见微控制器、通信和时钟参考电路。

二、主要电气参数

  • 标称频率:24.000 MHz
  • 常温频差:±10 ppm(25℃)
  • 频率稳定度(含温度漂移等):±20 ppm
  • 负载电容:20 pF
  • 等效串联电阻(ESR):60 Ω(典型)
  • 工作温度:-40 ℃ ~ +85 ℃

三、产品特点与优势

  • 国产化生产,供应链可控,适合国内量产替代。
  • 金属外壳、贴片封装,抗振动、散热性好,利于自动化贴装。
  • 3225 小尺寸兼顾体积与性能,适用于空间受限的消费、工业产品。
  • 频差与稳定度指标适合一般通信、MCU 时钟与外围定时应用。

四、使用建议

  • 负载电容选型:若外部两端对称电容为 C,则满足 CL ≈ C/2 + Cstray;以 PCB 寄生电容 2–5 pF 估算,建议两端电容约 30–36 pF(依据实际板上寄生调整)。
  • ESR 较高时需注意启动时间与振荡裕量,若驱动电路较弱请验证上电启动可靠性。
  • 焊接与回流:建议按通用贴片晶振回流规范执行,并参照产品 datasheet 的推荐焊盘与回流曲线。
  • ESD 与存储:为防静电损坏,请在 ESD 防护环境中操作,长期存放按干燥、防潮要求处理。

五、典型应用

  • 单片机/嵌入式系统主时钟
  • 通信模组与射频基带时钟源
  • 消费电子、物联网设备、工业控制与汽车电子(符合工作温度要求的应用)

六、包装与选型提示

  • 封装型号:SMD3225-4P(四引脚结构,便于夹位与贴装);具体引脚定义与电气图请参阅产品 datasheet。
  • 选型时关注系统对频差、温漂与启动时间的要求,如需更高稳定度或更低 ESR,可咨询厂商定制或选用更高等级产品。

如需完整技术参数表、封装图、推荐焊盘或样片采购信息,可提供需求,我可协助整理对应 datasheet 与选型建议。

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