Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI 0132M424000F18DTNJ
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 0132M424000F18DTNJ
- Type
- HCI
- Minimum package
- 3000 卷盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 0132M424000F18DTNJ
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.044g
- Frequency
- 24MHz
- Electronic Component
- 1
- Electronic Component
- BM0264527056
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 18pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0132M424000F18DTNJ 产品概述
一、产品简介
0132M424000F18DTNJ 为全国产化贴片晶振，品牌：HCI（杭晶）。器件为金属封装 SMD3225-4P，标称频率 24.000 MHz，设计用于对频率精度与长期稳定性有一定要求的电子系统时钟源与参考源。
二、主要技术参数
- 晶振类型：贴片晶振（SMD）
- 封装：3225（4P）金属封装
- 频率：24.000 MHz
- 常温频差：±10 ppm
- 频率稳定度（含温度影响等）：±20 ppm
- 负载电容：18 pF
- 等效串联电阻（ESR）：60 Ω
- 工作温度范围：-40 ℃ ～ +85 ℃
三、产品特性与优势
- 全国产化，供应链可控，适合国产化替换及本土化项目配套；
- SMD3225 小尺寸封装，适合高密度贴装的消费及工业电子产品；
- 常温频差 ±10 ppm，满足常见中高精度时钟需求；
- 宽温工作范围适配大多数工业级应用场景。
四、典型应用
- 微控制器与处理器时钟源；
- 无线通信模块与射频参考；
- 工业控制、仪表与测控设备；
- 嵌入式消费电子、网络设备及外围时序电路。
五、使用与选型建议
- 与晶振配套的电路板布局应保证晶振两脚到接地面的走线最短并做去耦；负载电容应按 18 pF 规格匹配并尽量靠近晶振引脚布置；
- 安装时避免对晶振施加机械应力或过高回流焊温度，遵循厂商推荐的焊接工艺；
- 在低噪声或高精度系统中，应考虑电源去耦与屏蔽以降低相位噪声影响；
- 若用于时间基准或通信同步，请在样机阶段验证温漂与相位噪声满足系统需求。
如需样片、规格书或可靠性试验数据，请联系 HCI（杭晶）授权经销或技术支持获取详细资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
