Model & package intelligence
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HCI 0121M4-38.400F10HPNNL 0121M4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- HCI 0121M4-38.400F10HPNNL
- Type
- HCI
- Minimum package
- 200 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 0121M4-38.400F10HPNNL
- Electronic Component
- 1
- Package
- SMD2016-4P
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0264820037
- Electronic Component
- Electronic Component
- Electronic Component
- 200
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0121M4-38.400F10HPNNL 产品概述
一、产品简介
0121M4-38.400F10HPNNL 是杭晶（HCI）推出的全国产化贴片晶振，专为要求体积小、厚度薄且频率精度高的电子终端设计。器件属 SMD 贴片晶振，封装型号为 SMD2016-4P（2016 尺寸），工作频率 38.4 MHz，适配各类对时钟精度和稳定性有较高要求的应用场景。
二、主要规格与性能
- 品牌：HCI（杭晶）
- 型号：0121M4-38.400F10HPNNL
- 晶振类型：贴片晶振（SMD）
- 频率：38.4 MHz
- 常温频差（25°C）：±10 ppm
- 频率稳定度（工作温度范围内）：±10 ppm
- 工作温度：-20 ℃ ~ +70 ℃
- 负载电容：10 pF（注：每端对地约为 5 pF，实际外接容值需考虑 PCB 杂散电容）
- 等效串联电阻（ESR）：80 Ω（典型/最大值指标，请在设计时预留裕量）
- 封装：SMD2016-4P，超小超薄，利于模块化、轻薄化设计
三、封装与工艺要点
该产品采用 2016 超小封装，厚度和占板面积均小，适合空间受限的终端产品。封装适配常规 SMT 回流焊工艺，建议：
- 将晶振放置于控制器/收发器的振荡引脚附近，走线尽量短且对称；
- 外接负载电容按 CL=10 pF 选型，实际每端电容值应扣除布局与器件本身寄生电容；
- 保持晶振周围接地平面完整，避免大电流回流路径和高频干扰源靠近。
四、典型应用
- 无线通信模块（蓝牙、Wi‑Fi 子模块、射频收发器）
- 工业/消费类 MCU 定时与时钟源
- 有线/无线数据传输与串行通信设备
- 可穿戴设备、智能终端与 IoT 节点
- 测试测量与精密计时系统（对 38.4 MHz 频率源有需求的场合）
五、选型与设计建议
- 若系统对启动时间、相位噪声或驱动电平有特殊要求，请与杭晶技术支持确认具体参数；
- 负载电容选择应综合 PCB 杂散电容与引脚电容，建议在调试阶段测量并微调外接电容以获得最佳频率；
- 在高干扰环境或长寿命应用中，建议评估频率老化特性与长期漂移，并在 BOM 阶段确定样件试验计划；
- 对于需更宽温度范围或更高稳定度的应用，可咨询厂方提供对应等级或定制化产品。
六、质量与可靠性
作为国产化晶振，0121M4-38.400F10HPNNL 在材料与制造工艺上满足通用电子产品的可靠性要求。建议在量产前进行封装级的焊接可靠性、温度循环、加速老化等验证，以确保整机长期稳定性。
七、总结
0121M4-38.400F10HPNNL 以其超小型封装（2016）、高精度（±10 ppm）与国产化优势，适合用于对体积、重量和频率稳定性有较高要求的现代电子产品。合理的 PCB 布局与负载电容配置能充分发挥其性能，若需更详细的电气特性或样品评估，建议联系杭晶（HCI）技术支持获取完整数据手册与测试报告。
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