WMSIC Electronic Components

HCI XC32M4-14.7456-F20NLDTL XC32M4

ModelXC32M4-14.7456-F20NLDTL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC32M4-14.7456-F20NLDTL
Type
HCI
Minimum package
3000 卷盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC32M4-14.7456-F20NLDTL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.04g
Frequency
14.7456MHz
Electronic Component
1
Electronic Component
BM0264527052
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC32M4-14.7456-F20NLDTL贴片晶振产品概述

XC32M4-14.7456-F20NLDTL是杭晶电子(HCI)针对工业级与消费电子场景推出的高精度SMD3225封装贴片晶振,核心频率14.7456MHz,以稳定的温度特性、精准的频率输出适配串口通信、单片机系统等需求,是小型化电子设备的可靠时钟源方案。

一、核心参数与性能解析

该晶振的关键参数具备明确的应用指向性,核心性能可满足多数电子设备的时钟要求:

  1. 频率与频差:14.7456MHz是串口通信领域的标准频率(14745600Hz可整数分频出115200bps、57600bps等常用波特率,无小数误差),常温频差±10ppm,远低于串口通信(一般要求±20ppm以内)的精度阈值,有效降低通信误码率;
  2. 负载电容:20pF为SMD3225封装的主流值,需通过皮尔斯振荡电路的外部电容(如C1=C2=40pF,并联后等效20pF)匹配,确保谐振频率与标称值一致;
  3. 等效串联电阻(ESR):60Ω处于同类晶振中等偏优水平,低ESR减少能量损耗,提升起振裕量,避免电路增益不足导致不起振;
  4. 频率稳定度:±20ppm覆盖-40℃~+85℃全温范围,满足工业级环境的温度波动需求(如户外传感器、车载辅助模块),防止频率漂移影响系统稳定性。

二、封装与适用场景

1. 封装特性

采用SMD3225-4P封装(3.2mm×2.5mm),4引脚贴片结构具备两大优势:

  • 小型化:适配高密度PCB设计,满足智能手表、物联网节点等小型设备的空间需求;
  • 自动化生产:兼容回流焊工艺,适合大规模批量生产,降低焊接成本与不良率。

2. 典型应用场景

  • 串口通信模块:工业PLC的RS232/RS485接口、智能家居网关的UART单元,利用整数分频特性实现精准波特率输出;
  • 单片机时钟源:适配8051系列、STM32F10x等MCU,作为外部高速时钟(HSE)提升运算精度;
  • 工业控制设备:温度传感器、电机控制器,在-40℃~+85℃环境下稳定提供时钟信号;
  • 消费电子:智能音箱、便携式医疗设备,兼顾小型化与稳定性需求。

三、可靠性与环境适应性

杭晶(HCI)的成熟工艺保障了产品可靠性:

  1. 宽温适应:工作温度-40℃~+85℃,符合IEC 60068-2-1/2标准,可在极端环境下稳定运行;
  2. 老化测试:生产中经过高温老化(85℃×24h),消除初期频率漂移,提升长期稳定性;
  3. 封装防护:密封式SMD3225封装防止水汽、灰尘侵入,避免石英晶体性能衰减。

四、应用设计注意事项

为确保稳定工作,需注意以下要点:

  1. 负载电容匹配:皮尔斯电路中,晶振负载电容为外部两个电容的并联等效值,需调整至20pF(如C1=C2=40pF);
  2. 焊接参数:回流焊峰值温度245℃±5℃,时间≤10s,避免高温损坏晶体;
  3. 储存环境:未焊接晶振储存在-10℃~+40℃、湿度≤60%RH环境,防止引脚氧化。

总结

XC32M4-14.7456-F20NLDTL以精准频率、工业级宽温、小型化封装,成为串口通信、单片机系统的高性价比选择。杭晶的可靠性设计使其适配工业控制、消费电子等多领域,是电子设备时钟源的可靠解决方案。

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