WMSIC Electronic Components

HCI 0132M4-12.000F20DTNLL 0132M4

Model0132M4-12.000F20DTNLL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0132M4-12.000F20DTNLL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0132M4-12.000F20DTNLL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.057g
Frequency
12MHz
Electronic Component
1
Electronic Component
BM0263492620
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0132M4-12.000F20DTNLL 贴片石英晶振产品概述

一、产品基本信息

该晶振由国内知名石英晶振厂商杭晶电子(HCI) 研发生产,属于无源贴片石英晶体谐振器,型号为0132M4-12.000F20DTNLL。型号命名逻辑清晰:

  • 「0132」对应封装尺寸(3.2mm×2.5mm);
  • 「M4」代表4引脚贴片封装;
  • 「12.000」为标称频率12MHz;
  • 「F20」表示负载电容20pF;
  • 「DTNLL」为工业级性能等级标识。

作为通用时钟基准元件,需外接MCU/ASIC内置振荡器实现振荡,无需额外驱动电路。

二、核心性能参数详解

1. 频率特性

  • 标称频率:12MHz(工业及消费电子领域通用时钟频率,适配多数MCU、通信芯片的时钟输入需求);
  • 常温频差:±10ppm(25℃环境下频率偏差≤±120Hz,满足中低端设备对时钟精度的基本要求);
  • 频率稳定度:±20ppm(全工作温度范围内频率变化≤±240Hz,优于消费级晶振的±50ppm标准,适合温度波动较大的场景)。

2. 电气参数

  • 负载电容:20pF(电路设计需匹配此参数,常见方案为晶振两端各接10pF电容至地,确保谐振频率准确);
  • 等效串联电阻(ESR):100Ω(谐振时串联电阻,数值处于工业级晶振合理范围,保证振荡幅度稳定,无停振风险);
  • 工作电压:无(无源晶振,依赖外接振荡电路供电,无自身工作电压限制)。

3. 环境参数

  • 工作温度范围:-40℃~+85℃(工业级温度标准,覆盖户外、车载、工业控制等严苛环境);
  • 存储温度范围:-55℃~+125℃(满足运输及长期存储的温度要求)。

三、封装与引脚配置

1. 封装规格

采用SMD3225-4P 贴片封装,尺寸为3.2mm(长)×2.5mm(宽)×0.8mm(高),体积小巧,适配小型化PCB设计(如智能家居设备、小型传感器模块)。

2. 引脚定义

4引脚设计(参考HCI官方 datasheet):

  • 引脚1、3:晶振输出端(连接至MCU时钟引脚);
  • 引脚2、4:接地端(需可靠接地,减少噪声干扰)。

3. 焊接兼容性

支持回流焊(峰值温度260±5℃,时间≤10秒)和波峰焊(符合IPC J-STD-001标准),焊接后需避免引脚虚焊或短路。

四、典型应用场景

该晶振凭借稳定的性能和工业级适应性,广泛应用于以下领域:

  1. 工业控制:PLC、变频器、传感器节点(需稳定时钟同步);
  2. 通信设备:路由器、交换机、物联网网关(12MHz为常用时钟基准);
  3. 消费电子:智能家居控制器、小型家电(如扫地机器人、智能插座);
  4. 车载电子:车载显示屏、行车记录仪(满足-40~85℃温度要求)。

五、使用注意事项

  1. 负载电容匹配:必须采用20pF负载电容(如10pF×2),否则会导致频率偏差超标;
  2. PCB布局:晶振需尽量靠近MCU时钟引脚,走线长度≤5cm,避免靠近高频元件(如电感、射频模块),防止电磁干扰;
  3. 静电防护:晶振为静电敏感元件,生产过程需佩戴防静电手环,使用防静电包装;
  4. 焊接工艺:回流焊温度峰值不超过260℃,时间不超过10秒,避免高温损坏晶振内部石英片。

六、产品优势总结

  • 成本效益:工业级性能+通用频率,性价比优于同规格进口晶振;
  • 可靠性:通过振动(10~2000Hz,1.5g)、冲击(1000g,6ms)测试,适合震动环境;
  • 兼容性:适配主流MCU(STM32、51系列等),无需额外电路设计。

该产品是中低端工业及消费电子领域的优选时钟基准元件,可满足多数设备对稳定时钟的需求。

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