WMSIC Electronic Components

HCI XC32M4-40.000-F12NJDT XC32M4

ModelXC32M4-40.000-F12NJDT
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC32M4-40.000-F12NJDT
Type
HCI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC32M4-40.000-F12NJDT
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.042g
Frequency
40MHz
Electronic Component
1
Electronic Component
BM0264340517
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC32M4-40.000-F12NJDT 贴片晶振产品概述

XC32M4-40.000-F12NJDT是杭晶电子(HCI)推出的一款工业级贴片晶振,针对中高速时钟需求场景优化设计,兼具小尺寸、高稳定性与宽温适应性,是多数电子设备时钟源的实用选择。

一、产品核心定位与差异化优势

该晶振聚焦“小封装+高稳定+工业级温宽”三大核心方向,区别于普通消费级晶振:

  1. 尺寸紧凑:采用SMD3225-4P封装(3.2mm×2.5mm),适配智能穿戴、IoT节点等小型化产品;
  2. 精度可靠:常温频差±10ppm、全温频率稳定度±30ppm,满足工业设备长期稳定运行需求;
  3. 环境兼容:工作温度覆盖-40℃~+85℃,可应对户外、车载周边等极端温变场景。

二、关键性能参数解析(用户视角)

每个参数直接影响实际应用效果,需重点关注:

  1. 频率与精度:标称40MHz是FPGA、MCU等高速数字电路的常用时钟频率;常温频差±10ppm(即40MHz×10⁻⁶=400Hz偏差),无需额外校准即可满足多数设备同步要求;
  2. 负载电容12pF:行业标准值,电路匹配无需特殊设计,降低工程师调试成本;
  3. 频率稳定度±30ppm:-40℃~+85℃范围内,频率相对于25℃的最大变化为±1.2kHz——极端温度下时钟仍稳定,避免设备误判或通信中断;
  4. 等效串联电阻(ESR)40Ω:ESR越低谐振损耗越小、输出信号越稳定;40Ω在同规格中处于中等偏优,减少电路发热,延长晶振寿命;
  5. 工作温度范围:-40℃(低温启动)至+85℃(高温持续),覆盖工业级环境要求,无需额外降额使用。

三、封装设计与生产适配性

SMD3225-4P封装是核心设计亮点:

  • 尺寸优势:3.2mm×2.5mm的小体积,比传统直插晶振节省70%以上PCB空间,适合高密度布线;
  • 贴装兼容性:4引脚贴片设计,支持SMT自动贴装,生产效率是手工焊接的数倍,降低量产成本;
  • 应力防护:4引脚比2引脚更能分散焊接应力,减少温度变化导致的频率漂移,实测长期老化率≤±5ppm/年。

四、典型应用场景梳理

该晶振性能适配多领域需求,常见应用包括:

  1. 工业控制:PLC模块、伺服驱动器、传感器节点的时钟基准;
  2. 通信设备:WiFi6路由器、蓝牙5.0模块、无线AP的频率同步;
  3. 消费电子:智能电视、机顶盒、智能音箱的高速时钟;
  4. 物联网(IoT):智能网关、环境传感器、穿戴设备的低功耗时钟;
  5. 车载周边:车载导航、行车记录仪的辅助时钟(温宽满足车内环境)。

五、可靠性与环保认证

杭晶HCI作为国内晶振龙头,该产品通过多项可靠性测试:

  • 高低温循环测试(-40℃→+85℃,循环100次),频率变化≤±30ppm;
  • 振动测试(10~2000Hz,加速度1g),无频率跳变;
  • 符合RoHS 2.0环保标准,不含铅、镉等有害物质,适配出口产品需求。

XC32M4-40.000-F12NJDT平衡了精度、尺寸与成本,是中高端电子设备时钟源的高性价比选择,尤其适合对温宽、稳定性有要求的工业与消费电子场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.