WMSIC Electronic Components

HCI XC53G2-12.288-F12LJDTL XC53G2

ModelXC53G2-12.288-F12LJDTL
PackageSMD5032-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC53G2-12.288-F12LJDTL
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC53G2-12.288-F12LJDTL
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.131g
Frequency
12.288MHz
Electronic Component
1
Electronic Component
BM0264820028
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC53G2-12.288-F12LJDTL 贴片晶振产品概述

一、产品核心定位与基础属性

XC53G2-12.288-F12LJDTL是杭晶电子(HCI) 推出的工业级贴片晶振,采用SMD5032-2P 小型化封装(尺寸约5.0×3.2×1.2mm),2引脚贴片结构,无铅环保设计。核心频率12.288MHz为串口通信、时钟分频的常用标准频率,可被115200bps(波特率)、32768Hz(实时时钟分频)等常用速率整除,简化电路设计,适配自动化贴片生产工艺。

二、关键性能参数解析

该产品核心参数覆盖工业级应用基本需求,具体解析如下:

  1. 频率精度:常温(25℃)频差±20ppm,实际频率波动范围为12.288MHz±245.76Hz,满足大多数数字电路时钟精度要求;
  2. 温度稳定性:频率稳定度±30ppm,覆盖工作温度-40℃~+85℃,可适应户外、车载等宽温环境;
  3. 负载电容:12pF,需与电路端总负载电容(晶振引脚寄生电容+振荡电路输入电容+外接电容)匹配,保证频率准确;
  4. 等效串联电阻(ESR):60Ω,属于常规工业级水平,需搭配驱动能力足够的振荡电路(如单片机内部振荡器),避免振荡不稳定;
  5. 工作温度范围:-40℃~+85℃,符合工业级器件温度要求,极端环境下仍稳定工作。

三、封装与可靠性设计

  1. 封装特性:SMD5032-2P为小型化贴片结构,适合回流焊、波峰焊等自动化贴装,可集成到高密度PCB板,节省空间;
  2. 可靠性测试:产品经过高低温循环、振动冲击(10~2000Hz,1.5g加速度)、湿度老化等测试,抗冲击性能达1000g(6ms半正弦波);
  3. 环保合规:符合RoHS 2.0、REACH标准,无铅无卤,适配绿色制造与出口需求。

四、典型应用场景

因频率特性与宽温适应性,该晶振广泛应用于:

  1. 串口通信模块:UART、RS232/485接口时钟源,直接分频得到115200bps、57600bps等波特率;
  2. 工业控制单元:PLC、单片机、嵌入式控制器主/辅助时钟,满足工业现场宽温需求;
  3. 消费电子:机顶盒、路由器、智能音箱时钟电路,辅助数据同步与定时;
  4. 小型通信设备:蓝牙/WiFi模块辅助时钟(部分低功耗模块分频用);
  5. 医疗电子:便携式医疗设备(血糖仪、血压计)时钟源,需稳定时间基准。

五、选型与使用注意事项

  1. 负载电容匹配:电路总负载电容需接近12pF,否则频率偏差超规格;
  2. ESR匹配:振荡电路增益需≥2×ESR(≥120),避免停振;
  3. 温度范围确认:若场景温度超出-40~+85℃(如航空航天),需换宽温/军品级;
  4. 贴装工艺:遵循SMD5032回流焊参数(预热150180℃/3060s,峰值230250℃/1020s),避免过热损坏。

六、品牌与质量保障

杭晶电子(HCI)拥有20余年晶体器件研发生产经验,产品覆盖全系列晶振。XC53G2-12.288-F12LJDTL出厂前经严格测试,批量一致性好,提供1年以上质保,售后技术支持完善,满足客户批量应用需求。

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