WMSIC Electronic Components

HCI 0153G2-8.000F08DTLJL 0153G2

Model0153G2-8.000F08DTLJL
PackageSMD5032-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0153G2-8.000F08DTLJL
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0153G2-8.000F08DTLJL
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.1g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264982132
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
8pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0153G2-8.000F08DTLJL贴片晶振产品概述

0153G2-8.000F08DTLJL是杭晶电子(HCI)推出的一款工业级贴片石英晶体谐振器,采用SMD5032-2P封装,以8MHz为基准频率,具备宽温适应性、稳定频差控制等特点,可满足工业控制、通信终端、车载电子等多场景的时钟同步需求。

一、产品基本属性

该型号属于贴片式石英晶体谐振器,核心功能是为电子电路提供稳定的基准时钟信号。品牌为国内专业晶振制造商杭晶电子(HCI),封装规格为SMD5032-2P(5.0×3.2×1.0mm标准贴片封装),2引脚设计适配自动化表面贴装(SMT)工艺,可直接集成于各类PCB板中,无需额外焊接辅助件。

二、核心性能参数及应用优势

1. 频率与频差控制

基准频率为8MHz,是数字电路中常用的中频基准;常温(25℃左右)频差为**±20ppm**,即常温下频率偏差仅±160Hz(计算方式:8×10⁶Hz × 20×10⁻⁶ = 160Hz),可满足多数MCU、传感器模块的时钟同步精度要求,避免因频率偏差导致的通信丢包、数据误码。

2. 负载电容与频率匹配

设计负载电容为8pF,是晶体谐振的关键匹配参数——需与电路实际负载电容(如MCU内部电容+外围电容)总和匹配,以保证晶体输出频率准确。杭晶该型号的8pF负载电容适配常见通信模块、工业控制器的电路设计,无需额外复杂调谐。

3. 宽温下的频率稳定度

工作温度范围为**-40℃~+85℃(工业级宽温),对应频率稳定度为±30ppm**,即温度变化范围内频率最大偏差±240Hz(8×10⁶×30×10⁻⁶=240Hz)。该指标可稳定应对户外设备、车载环境的温度波动,避免低温启动困难或高温频率漂移。

4. 低ESR与振荡可靠性

等效串联电阻(ESR)为80Ω,属于SMD5032封装下的优良水平。ESR越低,晶体启动速度越快、振荡功耗越低,且抗电磁干扰能力越强——该参数保证了产品在复杂电磁环境(如工业车间、车载总线)下仍能稳定输出时钟信号。

三、典型应用场景

结合性能参数,0153G2-8.000F08DTLJL适用于以下场景:

  1. 工业控制设备:PLC可编程控制器、传感器节点、电机驱动器,宽温适配车间高低温环境;
  2. 通信终端:IoT低功耗模块、蓝牙5.0/WiFi辅助时钟、4G/LTE射频前端,8MHz频率适配中频信号处理;
  3. 车载电子:仪表盘时钟、车载通信模块(如CAN总线节点)、车载摄像头,满足-40℃~+85℃的车载环境标准;
  4. 消费电子:智能家电(如空调控制器)、可穿戴设备(如智能手环),贴片封装便于小型化设计。

四、封装可靠性与生产适配

采用SMD5032-2P陶瓷封装,具备以下优势:

  • 防潮抗振:陶瓷封装可有效隔绝水汽,同时抵抗机械振动(杭晶测试显示,该型号可承受10g加速度振动);
  • 自动化适配:2引脚贴片设计符合SMT生产线标准,可实现高速贴装,降低生产损耗;
  • 尺寸紧凑:5.0×3.2×1.0mm的小尺寸,适合高密度PCB布局(如智能手机、IoT模块)。

五、品牌品质保障

杭晶电子(HCI)是国内石英晶体领域的老牌厂商,具备10余年晶振研发生产经验,产品通过RoHS 2.0、REACH等环保认证。0153G2-8.000F08DTLJL经过高低温循环测试(-40℃+85℃循环50次)、振动测试(102000Hz扫频振动)等可靠性验证,可满足工业级量产需求,供货周期稳定(常规1-2周)。

综上,0153G2-8.000F08DTLJL以工业级宽温、稳定频差、紧凑封装为核心优势,是中精度时钟需求场景的高性价比选择。

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