WMSIC Electronic Components

HCI 0121M4-32000F12DTNLL 0121M4

Model0121M4-32000F12DTNLL
PackageSMD2016-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0121M4-32000F12DTNLL
Type
HCI
Minimum package
3000 卷盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0121M4-32000F12DTNLL
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.033g
Frequency
32MHz
Electronic Component
1
Electronic Component
BM0264527051
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCI 0121M4-32000F12DTNLL 贴片晶振产品概述

一、产品基本信息

HCI 0121M4-32000F12DTNLL是杭晶电子(HCI)推出的工业级宽温贴片石英晶振,聚焦小型化、高可靠性时钟信号需求。产品型号命名清晰传递核心属性:

  • 「0121」对应封装尺寸代码(2.0×1.6mm);
  • 「M4」为振荡模式标识(基频振荡,性能稳定);
  • 「32000」明确工作频率32MHz(嵌入式系统常用时钟基准);
  • 「F12」表示匹配负载电容12pF;
  • 「DTNLL」为系列定制化标识(适配工业级可靠性要求)。

该晶振采用SMD2016-4P贴片封装,4引脚设计兼容自动化贴装工艺,是紧凑电子设备的核心时钟组件。

二、核心性能参数解析

参数精准覆盖中高端设备的时钟需求,关键指标如下:

参数项 规格值 实际意义 工作频率 32MHz 适配多数MCU、通信模块的时钟输入(如STM32系列、WiFi6模块) 常温频差(25℃) ±10ppm 频率偏差≤320Hz,满足99%以上嵌入式系统的精度要求 负载电容 12pF 电路需匹配2个6pF并联电容,确保振荡电路达到最佳稳定性 全温频率稳定度 ±20ppm 温度变化时频率波动≤640Hz,避免工业环境下的时钟漂移导致系统异常 等效串联电阻(ESR) 80Ω 同封装同频率晶振的偏低水平,降低功耗+提升振荡幅度稳定性 工作温度范围 -40℃~+85℃ 宽温覆盖工业车间、户外设备等极端环境

三、封装设计与适用场景

1. 封装优势

  • 小型化:2.0×1.6mm尺寸(比3225封装小30%),适配智能手环、TWS耳机等轻薄设备;
  • 高可靠性:4引脚贴片结构,焊接后与PCB贴合紧密,抗振动/冲击性能优于直插封装;
  • 工艺兼容:支持回流焊、波峰焊,适合大规模自动化生产。

2. 典型应用场景

  • 工业控制:PLC、工业传感器、电机驱动电路(宽温适配车间温度波动);
  • 消费电子:智能手表、便携式医疗设备(小型化节省PCB空间);
  • 通信模块:WiFi6、蓝牙5.0模块(32MHz为MCU常用时钟,保障数据传输精度);
  • 车载电子(工业级延伸):车载仪表盘、ADAS传感器外围电路(宽温适配-40℃~85℃的车载环境)。

四、环境适应性与可靠性

除宽温性能外,该晶振具备以下可靠性优势:

  • 抗振动:可承受10g(10-2000Hz)振动测试,适配移动设备、工业机械;
  • 抗冲击:满足1000g(0.1ms)冲击测试,避免运输/安装损坏;
  • 长期稳定性:石英晶片老化率≤±5ppm/年(典型值),保障设备3-5年使用期内精度一致;
  • 环保合规:符合RoHS 2.0、REACH标准,无铅焊接兼容全球市场。

五、品牌与品质保障

杭晶电子(HCI)是国内石英晶振领域老牌厂商,具备20余年研发生产经验:

  • 工艺优势:全自动晶片加工、封装生产线,关键参数一致性控制在行业前列;
  • 认证齐全:通过ISO9001、IATF16949(部分系列)认证,批量合格率≥99.9%;
  • 定制化支持:可调整频率、负载电容、封装等参数,满足客户差异化需求;
  • 技术服务:提供电路设计参考、振荡异常排查服务,协助客户快速落地。

总结

HCI 0121M4-32000F12DTNLL贴片晶振凭借小型化、宽温稳定、低ESR等核心优势,成为工业控制、消费电子、通信模块领域的高性价比时钟解决方案,适配对体积、精度、可靠性有综合要求的电子设备设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.