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HCI 049SS2-8000F20DTLJL 049SS2
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 049SS2-8000F20DTLJL
- Type
- HCI
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 049SS2-8000F20DTLJL
- Electronic Component
- 1
- Package
- HC-49SMD-2P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.962g
- Frequency
- 8MHz
- Electronic Component
- 1
- Electronic Component
- BM0264982087
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±20ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±30ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HCI 049SS2-8000F20DTLJL 贴片晶振产品概述
一、产品基本定位
049SS2-8000F20DTLJL是杭晶电子（HCI） 推出的一款中低频贴片晶振，采用HC-49S-SMD封装，核心频率为8MHz，属于工业级宽温型时钟基准器件。该产品兼顾成本控制与性能稳定性，适配多场景电子设备的时钟信号需求，是工业控制、车载电子、消费电子等领域的常用选型。
二、核心性能参数解析
关键参数直接决定应用适配性，具体如下：
- 频率与精度：标称频率8MHz，常温（25℃）频差±20ppm，即实际频率偏差≤160Hz（8×10⁶×20×10⁻⁶），满足大多数设备的时钟精度要求；
- 负载电容：20pF，需在电路中匹配对应电容以保证振荡频率稳定，避免负载不匹配导致频偏；
- 等效串联电阻（ESR）：60Ω，属于HC-49S封装的合理范围，较低ESR可提升振荡启动速度与稳定性，减少功耗；
- 频率稳定度：±30ppm，指-40℃~+85℃工作温度范围内的最大频偏，结合常温频差，总频偏控制在安全区间；
- 工作温度：-40℃~+85℃，覆盖工业级、车载级恶劣环境，可在严寒/湿热场景下稳定运行。
三、封装与物理特性
采用HC-49S-SMD贴片封装，相比直插HC-49S更适配自动化生产：
- 尺寸：长11.5mm×宽4.7mm×高3.5mm（行业标准参考），体积小巧，适配紧凑PCB布局；
- 引脚：2脚贴片式，无极性设计，便于焊接；
- 封装材料：陶瓷/塑料复合封装，兼具抗冲击、抗振动性能，降低成本的同时保证可靠性。
四、典型应用场景
基于宽温、稳定的性能，该晶振适用于：
- 工业控制：PLC、变频器、伺服驱动器等，需宽温时钟；
- 车载电子：导航、记录仪、传感器模块，满足-40℃~+85℃车载环境；
- 消费电子：机顶盒、路由器、智能电视，8MHz为常用时钟频率；
- 通信设备：小型基站、交换机，提供基础时钟基准；
- 医疗设备：便携监护仪、血糖仪，稳定时钟保证数据准确。
五、可靠性与应用注意事项
- 可靠性保障：HCI成熟工艺保证长期老化率≤±5ppm/年，可稳定工作数万小时；封装抗振动（10g~2000Hz）、抗冲击（1000g），适配运输与现场振动；
- 应用要点：
- 负载电容匹配：并联20pF陶瓷电容，避免频偏；
- 焊接温度：回流焊峰值≤260℃，焊接时间≤10秒，防止高温损坏；
- 布局设计：远离高频干扰源（电源、射频电路），时钟走线短且加屏蔽；
- 驱动能力：振荡电路驱动电流匹配60Ω ESR，避免不起振。
六、选型优势
相比同频同封装竞品，该产品具备：
- 宽温范围覆盖工业级需求，无需额外选型；
- ESR控制在60Ω，振荡稳定性优于部分竞品；
- HCI品牌供应稳定，性价比高；
- 贴片封装适配自动化生产，降低制造成本。
该晶振是兼顾性能与成本的实用选型，可满足多数中低端到中端电子设备的时钟需求。
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