WMSIC Electronic Components

HCI 3131M2-32.768DTTLRRL 3131M2

Model3131M2-32.768DTTLRRL
PackageSMD3215-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 3131M2-32.768DTTLRRL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
3131M2-32.768DTTLRRL
Electronic Component
1
Package
SMD3215-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.03g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264982122
Operating Temperature
40℃~+85℃
Electronic Component
±5ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Frequency
±5ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3131M2-32.768DTTLRRL 产品概述

3131M2-32.768DTTLRRL 是杭晶(HCI)全国产化的贴片表晶,面向低功耗计时、实时时钟(RTC)及便携类电子产品的高可靠频率源。器件采用SMD3215-2P封装,体积小、配套工艺成熟,便于SMT批量生产和自动化贴装。

一、主要参数概述

  • 晶振类型:贴片晶振(SMD)
  • 标称频率:32.768 kHz
  • 常温频差:±5 ppm
  • 频率稳定度:±5 ppm
  • 负载电容:12.5 pF
  • 等效串联电阻(ESR):70 kΩ
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD3215-2P
  • 品牌:HCI(杭晶)
  • 产品型号:3131M2-32.768DTTLRRL

二、产品特性与优势

  • 高频率精度高:常温频差与频率稳定度均控制在±5 ppm,满足高精度计时应用需求。
  • 低功耗设计:32.768 kHz为常用RTC频率,结合高ESR和合适的负载电容,能在低电流条件下稳定振荡,延长电池寿命。
  • 工业温度等级:-40 ℃ 至 +85 ℃的宽温工作范围,适用于多种工业与车载周边环境。
  • 全国产化保障:供应链本地化,交期可控,适合国产化替代与规模化采购。
  • 封装兼容性强:SMD3215-2P 封装适配常见PCB布局,便于自动化装配与回流焊工艺。

三、典型应用场景

  • 实时时钟(RTC)与低速计时模块
  • 可穿戴设备、手持终端、远程传感器等低功耗终端
  • 智能家居控制器与消费类电子产品
  • 工业控制与数据记录设备,要求长期稳定计时的场合

四、封装与焊接建议

  • 封装:SMD3215-2P(3.2 mm × 1.5 mm),建议在PCB上预留标准焊盘,参考厂家推荐的焊盘尺寸与贴装方向。
  • 焊接:兼容回流焊工艺,建议按IPC推荐的回流曲线实施,以保证可靠的焊点与长寿命性能。
  • 布局注意:晶振应与微控制器或RTC芯片的时钟输入管脚靠近布置,避免长走线和强干扰源并行布线。

五、可靠性与选型建议

  • 在高噪声或有强电磁干扰的系统中,建议增加旁路/滤波设计并在晶振与敏感信号之间保持适当屏蔽与走线间距。
  • 选型时请关注系统负载电容与晶振标称负载(12.5 pF)匹配,以确保最佳频率稳定性与启动特性。
  • 对于极端温度或更高频率精度的应用,可与供应商沟通定制测试或更严格的规格保证。

如需器件封装图、焊盘推荐尺寸或样品采购信息,可提供进一步的技术资料与支持。

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