WMSIC Electronic Components

HCI 3131M-32.768DWTLNN 3131M

Model3131M-32.768DWTLNN
PackageSMD3215-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 3131M-32.768DWTLNN
Type
HCI
Minimum package
3000 卷盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
3131M-32.768DWTLNN
Electronic Component
1
Package
SMD3215-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
1g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264526969
Operating Temperature
40℃~+105℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Frequency
±10ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3131M-32.768DWTLNN 产品概述

一、产品简介

3131M-32.768DWTLNN 为全国产化贴片表晶振,品牌 HCI(杭晶),封装为 SMD3215-2P(3.2 × 1.5 mm,两脚)。工作频率 32.768 kHz,专为低功耗实时时钟(RTC)与时间基准电路设计,尺寸小、功耗低、抗振性能良好,适合手持、穿戴、计量与物联网终端等对时间精度与长期稳定性有要求的场景。

二、主要参数

  • 晶振类型:贴片表晶(SMD tuning-fork)
  • 频率:32.768 kHz
  • 常温频差:±10 ppm
  • 频率稳定度(含温度漂移):±10 ppm
  • 负载电容:12.5 pF
  • 等效串联电阻(ESR):70 kΩ
  • 工作温度:-40 ℃ ~ +105 ℃
  • 封装:SMD3215-2P
  • 品牌:HCI(杭晶)
  • 国产化,量产交期与供应链可控

三、产品特点

  • 高频率精度高:常温±10 ppm,长期与温度稳定性良好,满足大部分 RTC 与计时类应用对时间精度的需求。
  • 小体积、低功耗:3215 小封装适合集成空间受限的 PCB 设计,配合 MCU 的低功耗振荡器可实现超低功耗待机。
  • 宽温度范围:-40 ℃ 至 +105 ℃,适用于工业级及户外设备环境。
  • 良好可焊性:SMD 封装适配常规回流焊工艺,便于表面贴装生产线高效组装。
  • 国产可替代性:在供应链紧张情况下有利于保证长期供货和一致性。

四、典型应用

  • 微控制器(MCU)或专用 RTC 芯片的外部时钟源
  • 可穿戴设备与智能手表的低功耗时钟
  • 智能电表、抄表终端与数据记录设备
  • IoT 终端、智能家居设备与无线传感节点
  • 医疗监测、计时仪器与实时数据记录系统

五、设计与使用建议

  • 振荡电路:常用 Pierce 振荡器结构,参考 MCU 或 RTC 厂商推荐电路布局。
  • 负载电容选择:标称负载电容为 12.5 pF,若电路板寄生电容(每端约 2–5 pF)需在计算中考虑。若两端电容相等,可按 C ≈ 2×(CL − Cstray) 选择,每侧典型取值约 18–22 pF(视 PCB 走线寄生电容实际值调整)。
  • 布局建议:晶体应尽量靠近 MCU/RTC 的 XTAL 引脚放置,信号走线短且对称,避免穿越大电流或高频干扰源。
  • 焊接与清洗:支持标准 SMD 回流焊工艺,建议按厂方回流曲线;清洗时避免强机械冲击与高温浸泡,常规无水或低残留清洗剂为宜。
  • 机械与静电防护:贴片晶体对机械应力敏感,贴装时避免挤压;在生产与调试过程中注意静电防护与正确夹持。

六、可靠性与质量保证

3131M-32.768DWTLNN 经过温度循环、长期老化与频率一致性筛选,满足工业级应用的稳定性要求。杭晶(HCI)作为国内晶振制造商,提供量产供货与技术支持,可根据项目需求协助样品测试与长期供货匹配。

总之,3131M-32.768DWTLNN 以其小型化、低功耗和良好温稳特性,适合对时间基准有严格要求且受限于空间与能耗的各类终端设备。若需原理图参考、封装尺寸图或回流曲线,请提供设计要求以便进一步支持。

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