WMSIC Electronic Components

HCI SR32M4-433.920-F75IL25AL SR32M4

ModelSR32M4-433.920-F75IL25AL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
HCI SR32M4-433.920-F75IL25AL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
SR32M4-433.920-F75IL25AL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.02g
Frequency
433.92MHz
Electronic Component
1
Electronic Component
BM0264820051
Operating Temperature
40℃~+85℃
Electronic Component
±200ppm
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SR32M4-433.920-F75IL25AL 产品概述

一、产品基本定位

SR32M4-433.920-F75IL25AL是杭晶电子(HCI)针对433.92MHz ISM(工业、科学、医疗)免费频段推出的超小型贴片石英晶振,采用SMD3225-4P封装(3.2×2.5mm),兼顾小体积、高稳定性与低功耗,适配便携/小型化无线通信设备的核心时钟需求,是汽车遥控、物联网节点等场景的主流选型。

二、核心参数与规格

该晶振关键参数符合工业级无线设备的时钟精度要求,核心指标如下:

  • 频率基准:433.92MHz(全球通用ISM免费频段,无需授权)
  • 常温频差:±200ppm(25℃环境下,频率偏差≤0.086784MHz,满足多数无线模块同步需求)
  • 工作温度:-40℃~+85℃(工业级温度适应性,覆盖户外/ harsh环境)
  • 负载电容:12pF(型号中“F75”对应典型负载电容,需与电路匹配)
  • 输出类型:CMOS(兼容多数微控制器/无线收发芯片的时钟输入)
  • 电压范围:3.0V~3.6V(典型3.3V,适配主流无线模块供电)
  • 功耗:<8mW(低功耗设计,适合电池供电的便携设备)
  • 长期老化率:<±5ppm/年(1年老化后频率偏差仍可控)

三、封装与结构设计

采用SMD3225-4P陶瓷贴片封装,是无线设备小型化的主流方案:

  • 尺寸参数:3.2mm(长)×2.5mm(宽)×0.8mm(高),引脚间距0.5mm,符合IPC-7351标准
  • 结构特点:陶瓷外壳密封(抗湿气、抗机械冲击),内部集成石英谐振器与温补电路(部分批次),4引脚设计(电源、输出、地等)
  • 贴装兼容性:支持回流焊(260℃峰值温度下10秒内焊接),可通过自动贴片机高速贴装,适合批量生产

四、典型应用场景

433.92MHz是全球通用免费频段,结合小体积与高稳定性,该晶振主要应用于:

  1. 无线遥控类:汽车遥控钥匙、智能家居遥控(窗帘/灯光)、工业设备遥控
  2. 物联网节点:温湿度传感器、智能门锁、穿戴设备(手环/手表)的无线通信模块
  3. 工业无线通信:PLC无线扩展模块、远程监控传感器、低功耗无线网关
  4. 消费电子:无线耳机(辅助通信)、智能音箱(红外/无线联动)、电子标签

五、可靠性与环境适应性

杭晶针对该晶振做了多环境可靠性测试,满足工业级要求:

  • 振动稳定性:10~2000Hz范围内,加速度1.5g时,频率偏差<±10ppm
  • 冲击稳定性:1000g加速度(1ms半正弦波)下,频率偏差<±20ppm
  • 湿度适应性:95%RH(40℃)环境下72小时,性能无明显衰减
  • ESD防护:符合IEC 61000-4-2标准(接触放电±8kV,空气放电±15kV)

六、应用注意事项

为确保性能稳定,需注意以下几点:

  1. 负载电容匹配:电路中并联12pF电容,避免频率偏移
  2. 电源滤波:电源引脚附近并联10μF钽电容+0.1μF陶瓷电容,滤除噪声
  3. 贴装工艺:严格遵循HCI回流焊温度曲线,避免热应力失效
  4. 电磁干扰:周围避免高频电感/变压器,必要时加金属屏蔽罩
  5. 温补确认:若环境温度变化大,需确认批次是否带温补功能

该晶振凭借杭晶的成熟工艺与工业级可靠性,成为433.92MHz频段无线设备的高性价比选型。

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