WMSIC Electronic Components

HCI 3111M-32.768DT06LLL 3111M

Model3111M-32.768DT06LLL
PackageSMD1610-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 3111M-32.768DT06LLL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
3111M-32.768DT06LLL
Electronic Component
1
Package
SMD1610-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.036g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264982139
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
6pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCI 3111M-32.768DT06LLL 石英晶体谐振器产品概述

一、核心技术参数与规格

HCI 3111M-32.768DT06LLL是一款针对32.768kHz时钟基准优化的石英晶体谐振器,核心参数精准匹配行业标准应用需求:

  • 基准频率:32.768kHz(1秒周期与二进制分频高度适配,是RTC、低功耗通信同步的黄金频率);
  • 常温频差:±20ppm(频率波动≤0.0002%,满足多数中高精度计时场景,如智能门锁每日误差≤5秒);
  • 负载电容:6pF(适配主流MCU/SoC的内部时钟匹配电路,无需额外补偿设计,简化硬件方案);
  • 频率稳定度:±20ppm(工作温度范围内频率波动可控,避免宽温下时钟漂移);
  • 工作温度:-40℃~+85℃(覆盖工业级、消费级及部分车载场景的环境需求)。

二、封装与生产适配性

产品采用SMD1610-2P表面贴装封装,尺寸仅1.6mm×1.0mm×0.5mm(典型值),属于小型化贴片范畴,适配高密度PCB设计:

  • 2引脚设计简化焊接工艺,兼容自动贴装(SMT)生产线,支持高速批量生产,降低终端厂商制造复杂度;
  • 引脚间距符合国际标准,与常用贴装设备(吸嘴、焊盘)兼容,无需特殊定制工装;
  • 封装厚度适配超薄PCB(如智能手环、蓝牙耳机),满足小型化终端的空间限制。

三、环境适应性与性能稳定性

工作温度范围-40℃~+85℃,可覆盖以下典型场景:

  • 工业控制模块(-40℃+85℃)、户外物联网传感器(-20℃+60℃);
  • 车载电子辅助时钟(-30℃+85℃)、消费电子便携设备(0℃+50℃)。

频率稳定度±20ppm在宽温下保持一致,例如:智能手表在-10℃低温环境下,计时误差仍可控制在每日3秒内,满足日常使用精度要求。

四、品牌与可靠性保障

HCI(杭晶电子)作为国内石英晶体领域的主流制造商,拥有20+年研发生产经验,产品具备:

  • 质量认证:通过ISO9001、IATF16949(车载级)认证,符合RoHS、REACH环保标准;
  • 可靠性测试:经过振动(10~2000Hz,1.5g)、冲击(1000g,1ms)、高温老化(85℃/1000小时)等测试,确保复杂工况下长期稳定;
  • 供应链优势:产能稳定,可满足中小批量至大规模订单需求,缩短终端产品交付周期。

五、典型应用场景

  1. 实时时钟(RTC)模块:智能手表、智能门锁、智能家居控制器(断电后保持时间);
  2. 物联网终端:低功耗传感器节点、蓝牙网关、NB-IoT模块(保障设备通信同步);
  3. 消费电子:蓝牙耳机、智能手环、便携式血糖仪(适配紧凑PCB空间);
  4. 工业控制:PLC模块、远程监控终端、工业传感器(满足宽温与高可靠性);
  5. 车载电子:车载信息系统辅助时钟、胎压监测(TPMS)模块(适配车载振动与温度波动)。

该产品凭借精准的频率特性、小型化封装及宽温稳定性,成为中低端至中端时钟基准应用的高性价比选择。

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