WMSIC Electronic Components

HCI CO75D6-156.250-33JDTST CO75D6

ModelCO75D6-156.250-33JDTST
PackageSMD7050-6P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI CO75D6-156.250-33JDTST
Type
SMD7050-6P
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
CO75D6-156.250-33JDTST
Electronic Component
1
Package
SMD7050-6P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.25g
Frequency
156.25MHz
Electronic Component
1
Electronic Component
BM0264568563
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~3.3V
Electronic Component
±10ppm
Output
LVDS
Frequency
±15ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CO75D6-156.250-33JDTST 晶体振荡器产品概述

CO75D6-156.250-33JDTST是杭晶电子(HCI)推出的工业级LVDS输出晶体振荡器,采用SMD7050-6P贴片封装,针对高速数据传输、宽温环境应用设计,具备高精度、高抗干扰、宽温稳定等核心特性,可满足通信、工业控制等领域的时钟同步需求。

一、产品基本信息

1. 品牌与型号定义

  • 品牌:杭晶电子(HCI),国内频率器件领域老牌厂商,专注晶振研发生产近30年,产品覆盖通信、工业、消费电子等多场景,以可靠性与一致性著称。
  • 型号解析:CO75D6为LVDS输出晶振系列;156.250为标称频率(156.25MHz);33为工作电压(3.3V);JDTST为封装与性能标识(SMD7050-6P封装+工业级温度范围)。

2. 封装规格

  • 封装类型:SMD7050-6P(表面贴装)
  • 尺寸:7.0mm×5.0mm×1.2mm(典型值,小型化设计节省PCB空间)
  • 引脚布局:6脚(含2组差分输出引脚、电源/地引脚)
  • 工艺优势:贴片工艺适配自动化生产,6脚布局便于差分信号布线,降低布线复杂度。

二、核心性能参数

该产品参数针对高速时钟应用优化,关键指标如下:

1. 频率特性

  • 标称频率:156.25MHz(适配10G/40G以太网、PCIe 3.0等高速协议的常用时钟频率)
  • 常温频差:±10ppm(25℃环境下,频率波动≤1562.5Hz,满足多数通信设备精度要求)
  • 全温频率稳定度:±30ppm(-40℃~+85℃范围内,频率波动≤4687.5Hz,覆盖工业级极端环境)

2. 输出特性

  • 输出模式:LVDS(低电压差分信号)
  • 输出电平:典型值1.2V(差分摆幅)
  • 上升/下降时间:≤1ns(高速信号传输需求,减少信号失真)
  • 输出负载:建议100Ω差分负载(符合LVDS标准,保证信号完整性)

3. 电气与环境特性

  • 工作电压:3.3V±5%(宽电压范围,适配主流系统供电)
  • 工作温度:-40℃~+85℃(工业级温度范围,解决户外/工业现场温度波动问题)
  • 存储温度:-55℃~+125℃(宽存储范围,便于库存管理)
  • 功耗:典型值≤50mW(低功耗设计,适配电池供电或低功耗系统)

三、关键特性与应用优势

1. 高抗干扰LVDS输出

LVDS差分信号通过正负端同步传输,可抑制共模噪声(抗EMI能力比单端输出强30dB以上),适合基站RRU、光传输设备等高速数据传输场景,避免信号失真导致的数据错误。

2. 宽温稳定工作

-40℃~+85℃的工业级温度范围,解决了户外基站、工业机器人等应用中温度波动大的问题;全温下±30ppm的稳定度,保证系统时钟同步精度不下降。

3. 高精度频率控制

常温±10ppm的频差满足10G以太网(要求≤20ppm)、测试测量设备等高精度需求;全温稳定度覆盖工业级严苛标准,减少数据传输错误率。

4. 通用兼容性

  • 3.3V工作电压适配嵌入式系统、通信设备的主流供电设计;
  • SMD7050-6P为行业通用封装,可与同类产品兼容替换,降低设计与替换成本。

5. 高可靠性

杭晶产品经过振动(10~2000Hz,1.5g)、冲击(1000g,0.5ms)、老化(1000小时)等严格测试,平均无故障时间(MTBF)≥100万小时,满足工业级产品长期稳定运行需求。

四、典型应用场景

CO75D6-156.250-33JDTST主要应用于需要高速、稳定时钟的领域:

1. 通信设备

  • 基站RRU/BBU、5G小基站;
  • 光传输设备(OTN、SDH)、10G/40G以太网交换机;
  • Wi-Fi 6/6E设备、卫星通信终端。

2. 工业控制

  • PLC(可编程逻辑控制器)、工业机器人;
  • 机器视觉系统、工业以太网节点;
  • 智能电网终端、风电/光伏监控设备。

3. 消费电子与车载

  • 4K/8K高清机顶盒、智能电视;
  • 车载信息娱乐系统、ADAS(高级驾驶辅助系统);
  • 无人机飞行控制器、VR/AR设备。

4. 测试测量

  • 示波器、信号发生器、频谱分析仪;
  • 高速数据采集卡、逻辑分析仪。

五、选型与应用注意事项

1. 电气匹配

  • 确认系统供电为3.3V±5%,避免过压(>3.6V)或欠压(<3.0V)导致晶振停振;
  • LVDS输出需匹配100Ω差分负载(可通过PCB布线并联100Ω电阻实现)。

2. 焊接与存储

  • 采用回流焊工艺,焊接温度峰值≤260℃(持续时间≤10s),避免损坏内部晶体;
  • 存储时远离机械振动、湿度>60%的环境,建议密封存储。

3. 布线设计

  • 差分输出引脚(通常为3/4脚)需等长布线,减少信号 skew;
  • 电源引脚(1/6脚)就近并联0.1μF陶瓷电容,滤除电源噪声。

4. 性能验证

  • 系统集成前,用频谱分析仪测量输出频率,确认常温频差≤±10ppm;
  • 用高低温箱测试全温下的频率稳定度,验证是否满足应用需求。

CO75D6-156.250-33JDTST凭借高速LVDS输出、宽温稳定、高精度等特性,成为通信、工业等领域的理想时钟解决方案,可有效提升系统的时钟同步精度与抗干扰能力。

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