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HCI 1575D-200.000JWVDTL 1575D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 1575D-200.000JWVDTL
- Type
- HCI
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 1575D-200.000JWVDTL
- Electronic Component
- 1
- Package
- SMD7050-6P
- Electronic Component
- Active Crystal Oscillator
- Electronic Component
- 0.281g
- Frequency
- 200MHz
- Electronic Component
- 1
- Electronic Component
- BM0264568456
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.5V~3.3V
- Electronic Component
- ±10ppm
- Output
- LVDS
- Frequency
- ±15ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1575D-200.000JWVDTL 产品概述
一、产品概览
1575D-200.000JWVDTL 是杭晶（HCI）推出的一款低抖动差分有源晶振，输出频率 200.000 MHz，采用 LVDS 差分输出，标准 SMD7050-6P 封装。器件工作电压范围宽（2.5V–3.3V），常温频差优异（±10 ppm），工作温度范围 -40℃ ~ +85℃，频率稳定度达到 ±15 ppm，适用于对时钟精度、相位噪声和信号完整性要求较高的高速系统。
二、主要特点
- 精确频率：标称 200.000 MHz，常温初始频差 ±10 ppm，长期及环境影响下频率稳定度 ±15 ppm。
- 低抖动：为高速数字和模拟系统提供低相位噪声、低周期抖动的时钟源（差分输出提高抗干扰能力）。
- 差分 LVDS 输出：兼容 LVDS 收发芯片和 FPGA/SerDes 等差分输入，便于高速链路设计。
- 宽电压与温度范围：工作电压 2.5 V 至 3.3 V；工业级温度范围 -40℃ ~ +85℃。
- 紧凑封装：SMD7050-6P 表面贴装，便于高密度 PCB 布局与自动化生产。
- 品牌保障：杭晶（HCI）制造与质量控制，适合工业与通信级应用场景。
三、典型应用
- FPGA、CPLD 主时钟与分频时钟源
- 高速数据采集（ADC/DAC）、采样时钟
- SerDes、PHY 与链路同步时钟
- 通信基站、交换设备与网通设备时钟
- 测试测量仪器、广播和视频链路时钟源
四、电气与环境指标（概要）
- 频率：200.000 MHz
- 输出模式：LVDS 差分
- 工作电压：2.5 V 至 3.3 V
- 常温频差（Initial Accuracy，25℃）：±10 ppm
- 频率稳定度（含温度、老化等）：±15 ppm
- 工作温度：-40℃ 至 +85℃
- 封装：SMD7050-6P，6 引脚
（注：如需更详细的时序、相位噪声、输出摆幅、启停特性及引脚分配，请参考厂商完整数据手册或联系杭晶技术支持。）
五、PCB 设计与使用建议
- 差分线对保持恒定差分阻抗（通常 100 Ω），并尽量走短直线避免急弯。
- 在 VCC 端紧邻晶振封装放置去耦电容（例如 0.1 μF 及 1 μF 并联），以抑制电源噪声。
- LVDS 输出端采用差分终端阻抗匹配（末端并联 100 Ω 差分终端）以保证信号完整性。
- 避免在晶振附近放置大电流开关器件与高速信号源，减小耦合干扰。
- 参考地平面连续，减少地回流路径，保障低噪声工作环境。
六、选型与采购提示
订购型号：1575D-200.000JWVDTL（品牌：HCI / 杭晶，封装：SMD7050-6P）。在批量采购前建议确认具体引脚定义、输出幅值、相位噪声与老化特性，以便与系统接口、频率容差和可靠性要求完全匹配。如需定制频差、温漂或特殊测试报告，可与厂商沟通技术支持与可靠性验证服务。
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