WMSIC Electronic Components

HCI XC53G2-8.000-F20LJDTK XC53G2

ModelXC53G2-8.000-F20LJDTK
PackageSMD5032-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC53G2-8.000-F20LJDTK
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC53G2-8.000-F20LJDTK
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
1g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264526980
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC53G2-8.000-F20LJDTK 贴片晶振产品概述

XC53G2-8.000-F20LJDTK是杭晶电子(HCI)推出的一款工业级SMD贴片石英晶振,专为需要稳定8MHz时钟基准的电子系统设计,兼具小体积、宽温适应、高可靠性等特点,可满足工业控制、消费电子、通信设备等多领域的应用需求。

一、产品定位与核心属性

该晶振属于HCI XC53G2系列主流贴片晶振,采用SMD5032-2P封装(5.0×3.2×1.2mm标准尺寸),核心定位为通用型8MHz时钟源,针对对频率精度、温度稳定性有一定要求的中低端电子设备,平衡了性能与成本,适合批量应用场景。其核心属性可概括为:小体积贴片封装、宽温工作范围、稳定的频率特性、低ESR易起振。

二、关键性能参数详解

晶振的性能参数直接决定其在系统中的适配性,XC53G2-8.000-F20LJDTK的核心参数如下:

1. 基础频率与精度

  • 标称频率:8MHz,是数字电路中常用的系统时钟基准(如MCU、FPGA的主时钟分频起点);
  • 常温频差:±20ppm,即常温(25℃左右)下频率偏差不超过8MHz×20×10⁻⁶=160Hz,满足大多数工业控制、消费电子的时钟精度要求(如普通MCU的时钟精度需求通常在±50ppm以内);
  • 频率稳定度:±30ppm,指工作温度范围内(-40℃~+85℃)相对于常温的频率变化不超过30ppm,确保宽温环境下时钟信号的稳定性,避免因温度变化导致系统时序异常。

2. 振荡匹配参数

  • 负载电容:20pF,是晶振工作时需匹配的外部电容值(通常为两个10pF电容并联,总负载20pF),该参数直接影响振荡电路的起振条件与频率稳定性,需严格按 datasheet 匹配;
  • 等效串联电阻(ESR):80Ω,属于工业级贴片晶振的合理范围,ESR值越小,振荡电路越容易起振,且功耗越低,80Ω的ESR可保证在不同电源电压、负载条件下稳定起振,不易受干扰。

3. 环境适应性参数

  • 工作温度范围:-40℃~+85℃,覆盖了工业级环境的典型温度区间(如户外传感器、车载辅助设备),可在极端温度下持续稳定工作;
  • 存储温度范围:-55℃~+125℃(参考HCI官方标准),满足产品存储与运输的环境要求。

三、封装与应用场景

1. 封装特性

采用SMD5032-2P封装(表面贴装,2引脚),尺寸为5.0×3.2×1.2mm,具有以下优势:

  • 小型化:节省PCB空间,适合小型化电子设备(如智能手环、微型PLC模块);
  • 贴装便捷:适配自动化SMT生产线,生产效率高,降低人工成本;
  • 抗干扰:贴片封装的寄生参数小,抗电磁干扰能力优于插件晶振,适合对EMC要求较高的场景。

2. 典型应用场景

  • 工业控制领域:PLC模块、传感器节点、电机控制器的时钟基准;
  • 消费电子领域:智能穿戴(智能手环、手表)、智能家居控制器(网关、开关)的MCU时钟;
  • 通信设备领域:小型路由器、IoT网关、蓝牙模块的系统时钟;
  • 车载电子领域:车载辅助系统(如倒车雷达、胎压监测)的低功耗时钟源(宽温适应车载环境)。

四、可靠性与品质保障

HCI作为国内专业晶振制造商,XC53G2系列产品经过严格的可靠性测试,确保批量应用的稳定性:

  • 可靠性测试:包括温度循环测试(-40℃~+85℃循环)、振动测试(符合IEC 60068-2-6标准)、老化测试(168小时高温老化),降低产品早期失效风险;
  • 环保认证:符合RoHS、REACH等环保标准,满足出口及国内环保要求;
  • 一致性保障:采用成熟的石英晶体加工工艺,批量产品的频率偏差、ESR一致性好,避免单批产品性能波动。

五、总结

XC53G2-8.000-F20LJDTK作为HCI推出的工业级8MHz贴片晶振,以稳定的频率特性、宽温适应、小体积封装为核心优势,覆盖了工业控制、消费电子等多领域的时钟需求,兼具成本竞争力与可靠性,是中低端电子系统时钟源的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.