WMSIC Electronic Components

HCI 049SS2-12.000F18DTNJL 049SS2

Model049SS2-12.000F18DTNJL
PackageHC-49SMD-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 049SS2-12.000F18DTNJL
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
049SS2-12.000F18DTNJL
Electronic Component
1
Package
HC-49SMD-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.928g
Frequency
12MHz
Electronic Component
1
Electronic Component
BM0264820035
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
18pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCI 049SS2-12.000F18DTNJL 贴片晶振产品概述

一、产品基础定位

HCI 049SS2-12.000F18DTNJL是杭晶电子(HCI)推出的工业级贴片石英晶振,专为需要稳定时钟信号的嵌入式系统、工业控制及消费电子设备设计。型号中:「049SS2」代表HC-49S-SMD封装系列,「12.000F」明确标称频率12MHz,「18DTNJL」包含负载电容18pF、宽温范围等核心参数定义,是数字电路中高性价比的时钟源选择。

二、关键电性能参数解析

该晶振的核心参数覆盖精度、稳定性及适配性,具体如下:

  1. 频率与精度
    标称频率为12MHz(数字电路通用时钟频率),常温(25℃)下频差±10ppm(即实际频率偏差≤±120Hz),满足单片机、FPGA等设备对时钟精度的基本要求,无需额外校准即可稳定工作。

  2. 全温频率稳定度
    工作温度范围为**-40℃~+85℃(工业级标准),全温范围内频率稳定度±30ppm**(最大偏差≤±360Hz),可适配户外传感器、车载电子等高低温场景,无需额外温控措施。

  3. 负载电容与ESR

    • 标称负载电容18pF:需匹配电路中晶振两端的等效电容(含PCB寄生电容),设计时通过外部电容(通常2个并联/串联)调整至18pF,避免频率偏移;
    • 等效串联电阻(ESR)40Ω:中等阻值,既保证振荡电路易起振(ESR过高易导致不起振),又控制功耗,适配绝大多数MCU的内部振荡模块。

三、封装与物理特性

采用HC-49S-SMD贴片封装,尺寸约为10.5mm(长)×4.5mm(宽)×3.5mm(高),具备以下优势:

  • 支持自动化SMT贴装,适配批量生产,降低人工成本;
  • 陶瓷/塑料外壳防护,抗机械振动、环境湿度及电磁干扰(EMI);
  • 引脚间距符合PCB设计规范,可直接集成于高密度电路板。

四、典型应用场景

12MHz是数字电路的通用频率,结合该晶振的宽温特性与贴片封装,主要应用于:

  • 嵌入式系统:STM32、51系列单片机、FPGA等核心时钟源;
  • 工业控制:PLC可编程逻辑控制器、传感器模块、工业网关;
  • 消费电子:智能穿戴(手环/手表)、遥控器、智能家居设备;
  • 通信模块:低功耗蓝牙(BLE)、WiFi模块(辅助时钟);
  • 车载电子:车载显示屏、行车记录仪(宽温环境适配)。

五、产品优势与使用建议

  1. 品牌可靠性:杭晶(HCI)是国内石英晶振主流厂商,产品经过振动、冲击、老化等可靠性测试,长期稳定性有保障;
  2. 宽温适配:-40℃~+85℃覆盖工业/车载严苛场景,无需额外温控;
  3. 电路适配建议:
    • 负载电容匹配:若PCB寄生电容约2pF,可选用2个32pF电容分别接晶振两脚到地(CL=(32×32)/(32+32)+2=18pF);
    • 焊接温度:回流焊峰值温度≤260℃,避免晶体受损;
    • 干扰防护:远离高频电路、电源纹波(增加滤波电容),减少频率偏移。

六、总结

HCI 049SS2-12.000F18DTNJL贴片晶振凭借12MHz通用频率、±30ppm宽温稳定度、18pF负载电容及HC-49S-SMD封装,成为嵌入式、工业控制等领域的高性价比时钟源。产品兼顾可靠性与生产适配性,适合各类需要稳定时钟信号的设备设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.