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HCI 0153G2-8.000F12DTNL 0153G2
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 0153G2-8.000F12DTNL
- Type
- HCI
- Minimum package
- 1000 卷盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 0153G2-8.000F12DTNL
- Electronic Component
- 1
- Package
- SMD5032-2P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 1g
- Frequency
- 8MHz
- Electronic Component
- 1
- Electronic Component
- BM0264527048
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0153G2-8.000F12DTNL 产品概述
一、产品概况
0153G2-8.000F12DTNL 为杭晶 (HCI) 全国产化贴片晶体振荡器，封装为 SMD5032-2P（5032 尺寸，2 引脚），采用玻璃密封结构与陶瓷基体。标称频率 8.000 MHz，常温频差 ±10 ppm，规定负载电容 12 pF，整机频率稳定度（-40℃ ～ +85℃）可达 ±20 ppm。等效串联电阻（ESR）典型值 80 Ω，工作温度范围 -40℃ ～ +85℃，适用于消费类与工业类电子产品的时钟源与振荡参考。
二、主要特性
- 频率：8.000 MHz，常温频差 ±10 ppm。
- 负载电容（CL）：12 pF（器件标称）。
- 频率稳定度：±20 ppm（工作温度范围内）。
- 等效串联电阻（ESR）：80 Ω（典型）。
- 封装：SMD5032-2P；2 引脚贴片，玻璃密封。
- 工作温度：-40℃ ～ +85℃。
- 全国产化，品牌：HCI（杭晶），适合中高可靠性批量供应。
三、典型应用
适用于单片机（MCU）系统的主时钟、实时时钟（RTC）参考、通信模块（低速串口时钟）、传感器与物联网终端、消费电子与工业控制设备等需要稳定时基的场景。80 Ω ESR 适配常见低功耗振荡器驱动范围，需根据具体驱动电路评估振荡启动裕度。
四、设计与安装要点
- 布局：晶体应靠近振荡器输入管脚（例如 MCU XTAL/OSC 引脚）放置，走线尽量短而对称，避免穿过或靠近高速信号线与开关电源噪声源。
- 接地与旁路：负载电容一端接地的回路应短且完整，尽量在电容旁设置地盲孔或地层，减少杂散电容与噪声耦合。
- 负载电容选择：外接电容需考虑 PCB 寄生电容，满足公式 CL = (C1·C2)/(C1+C2) + Cstray。若 C1=C2=C，则 C = 2·(CL - Cstray)。举例：若寄生 Cstray 约 2–5 pF，为达到标称 CL=12 pF，外接电容可在约 14–20 pF 范围评估与调试。最终值应通过实际板级测量确认振荡频率与启动性能。
- 焊接与可靠性：建议采用常规 SMD 回流焊工艺并遵循厂方焊接曲线与存储说明，避免在回流与后处理过程中对晶体施加过大机械应力或使用强烈超声清洗。
- ESD 与取放：晶体本体对静电通常不如半导体敏感，但振荡电路中半导体器件应做好 ESD 防护，取放与贴装时遵循普通无尘与防静电操作。
五、质量与采购建议
该型号为杭晶（HCI）国产化产品，适合追求供应链本地化与性价比的项目。批量采购前建议索取样品做板级验证（频率偏差、启动时间、温漂与长期老化测试），并参照厂家完整数据手册核对回流焊允许温度、抗冲击与加速老化等可靠性指标。若需替代或配套的振荡电路配置建议，欢迎在样机验证阶段同步评估。
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