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HCI 1532H-25.000A12DZSL 1532H
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 1532H-25.000A12DZSL
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 1532H-25.000A12DZSL
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Active Crystal Oscillator
- Electronic Component
- 0.04g
- Frequency
- 25MHz
- Electronic Component
- 1
- Electronic Component
- BM0264210146
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.2V
- Operating Current
- 10mA
- Electronic Component
- ±30ppm
- Output
- HCMOS
- Frequency
- ±70ppm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1532H-25.000A12DZSL 产品概述
一、产品简介
1532H-25.000A12DZSL 是 HCI（杭晶）推出的一款高精度、宽温区的表贴晶振，标称频率 25.000 MHz。器件采用 SMD 3225-4P 封装，输出方式为 HCMOS，工作电压仅 1.2 V，静态工作电流典型值 10 mA，适合对体积、功耗与精度有综合要求的嵌入式与通信类系统。
二、主要性能亮点
- 频率：25.000 MHz，常温频差（初始公差） ±30 ppm，保证出厂一致性；整体频率稳定度 ±70 ppm，适应大多数工业级时钟需求。
- 工作电压：1.2 V，满足低压系统与下一代低功耗芯片的接口要求。
- 输出模式：HCMOS，提供与数字逻辑直接耦合的电平输出，便于与 MCU、FPGA 等器件对接。
- 温度范围：-40 ℃ ~ +125 ℃，适合工业级和部分高温应用场景。
- 封装：SMD 3225-4P，体积小、易于高速贴装与自动化生产。
三、典型应用场景
- 嵌入式主控与通信模块的系统时钟（MCU/FPGA/ASIC）
- 无线通信基站、数据传输设备的参考时钟
- 工业控制、仪表与传感器网关，需在宽温区下长期稳定运行的场合
- 低压供电的便携式或电池供电设备，对节能与体积有要求的应用
四、封装与安装建议
3225-4P 表贴封装适合标准 SMT 生产线。焊接时建议靠近电源引脚放置去耦电容（如 0.01–0.1 µF），并保证合理的地平面以降低噪声耦合。器件属敏感元件，贴装与回流焊参数请参照厂商推荐的焊接曲线，避免反复回流与超温。
五、设计与可靠性提示
为发挥器件的精度与稳定性，应注意系统侧的电源稳定、信号线阻抗匹配与走线隔离。频率稳定度受温度、负载与老化影响，建议在关键应用中做系统级校准或温漂补偿。器件工作温度覆盖 -40 ℃ 至 +125 ℃，适用于多数工业环境；如需满足特定认证（例如汽车级 AEC），请与厂商确认具体型号与认证状态。
六、采购与支持
HCI（杭晶）品牌提供出厂测试资料与批次稳定性保障。订购时请注明型号 1532H-25.000A12DZSL、需求数量及回流焊工艺要求，便于提供匹配的技术文档与封装外形尺寸图。若需样品评估或量产支持，可联系厂商技术支持获取更详细的应用建议与资料。
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