Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI 1532H-33.333JWVDTSL 1532H
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 1532H-33.333JWVDTSL
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 1532H-33.333JWVDTSL
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Active Crystal Oscillator
- Electronic Component
- 0.433g
- Frequency
- 33.333MHz
- Electronic Component
- 1
- Electronic Component
- BM0264982138
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.8V~3.3V
- Operating Current
- 10mA
- Electronic Component
- ±10ppm
- Output
- HCMOS
- Frequency
- ±20ppm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1532H-33.333JWVDTSL 产品概述
一、产品简介
1532H-33.333JWVDTSL 是杭晶（HCI）推出的一款高精度、工业级表贴晶振，基准频率为 33.333 MHz。器件采用 SMD3225-4P 小型封装，输出为 HCMOS 电平，适配 1.8V~3.3V 多电压工作环境，专为对频率精度与长期稳定性有较高要求的数字系统设计。
二、主要技术参数
- 品牌：HCI（杭晶）
- 型号：1532H-33.333JWVDTSL
- 频率：33.333 MHz
- 常温频差：±10 ppm（室温）
- 频率稳定度（含温度、老化等影响）：±20 ppm
- 输出模式：HCMOS（方波）
- 工作电压：1.8 V ~ 3.3 V
- 典型工作电流：约 10 mA
- 工作温度：-40 ℃ ~ +85 ℃
- 封装：SMD 3225-4P（表面贴装，4 引脚）
- 特性：高精度、高可靠性、适合工业温度范围
三、性能特点
- 高精度：室温下常温频差可达 ±10 ppm，满足精密时钟、通信与测量系统的频率要求。
- 宽电源兼容：支持从 1.8V 到 3.3V 的工作电压范围，可直接驱动 MCU、FPGA 等逻辑器件。
- 稳定性好：整体频率稳定度 ±20 ppm，适应温度及环境变化。
- 小尺寸封装：3225 尺寸便于高密度 PCB 布局与自动贴装，提高可靠性与成本效率。
- HCMOS 输出：提供标准方波信号，驱动能力强，易于与数字电路接口。
四、封装与使用建议
- 封装为 SMD3225-4P，建议按厂商推荐的 PCB 封装尺寸设计焊盘，采用回流焊工艺贴装。
- 在电源引脚附近放置 0.01 μF ~ 0.1 μF 陶瓷去耦电容，尽量靠近器件以抑制电源噪声。
- 输出信号连线尽量短且阻抗匹配良好；若线路较长或连接到高输入容性负载，可在输出端串联 22Ω~47Ω 串联电阻以改善信号完整性。
- HCMOS 输出摆幅随 VCC 而定，请确认下游逻辑电平兼容性。
五、典型应用
- 微处理器/微控制器时钟源（MCU）
- FPGA、CPLD 等可编程逻辑时钟
- 通信设备与网络设备时钟参考
- 工业控制与自动化设备
- 精密测试与测量仪器
- 其他对频率精度和稳定性有要求的数字系统
六、选型与注意事项
- 确认系统工作电压并选择相应供电，以保证 HCMOS 电平兼容。
- 根据系统对相位噪声与抖动的具体要求，必要时与厂方确认相关指标。
- 在关键应用（如同步通信、计量）建议先进行样品评估与长期老化测试。
- 注意焊接温度曲线，避免超出器件工艺极限以保证长期可靠性。
七、可靠性与品质保证
杭晶（HCI）产品通过严格的出厂筛选与测试，适用于工业温度范围（-40 ℃ 至 +85 ℃）。建议在量产前按实际应用环境进行可靠性验证（温度循环、振动、湿热等），以确保长期稳定运行。
如需完整数据手册（引脚定义、封装尺寸、温度频率曲线及环境测试报告），可联系杭晶技术支持或授权代理获取。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
