WMSIC Electronic Components

HCI 1575H-200.000JWPDTS 1575H

Model1575H-200.000JWPDTS
PackageSMD7050-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 1575H-200.000JWPDTS
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
1575H-200.000JWPDTS
Electronic Component
1
Package
SMD7050-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
1g
Frequency
200MHz
Electronic Component
1
Electronic Component
BM0264982117
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Operating Current
20mA
Electronic Component
±10ppm
Output
HCMOS
Frequency
±20ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1575H-200.000JWPDTS 产品概述

一、产品简介

1575H-200.000JWPDTS 是杭晶(HCI)推出的一款高可靠性固定频率晶体振荡器,标称频率 200.000 MHz,输出为 HCMOS 电平,适用于要求高频稳定性和工业级温度范围的数字时钟源。器件采用 SMD7050-4P 表面贴装封装,兼顾体积和散热性能,适合集成到各种通信、测量与控制系统中。

二、主要规格

  • 频率:200 MHz(200.000 MHz 标称)
  • 常温频差:±10 ppm(出厂校准)
  • 频率稳定度(总体):±20 ppm
  • 输出模式:HCMOS
  • 工作电压:2.5 V ~ 3.3 V
  • 工作电流:典型 20 mA
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 品牌:HCI(杭晶)
  • 封装:SMD7050-4P

三、性能特点

  • 宽电压范围 2.5~3.3V,可兼容多种逻辑电平和电源方案;
  • 稳定度良好:常温校准 ±10 ppm,总体稳定度 ±20 ppm,可满足多数工业与通信应用对时钟精度的要求;
  • HCMOS 输出直接驱动数字电路,易于与 FPGA、CPLD、微控制器及逻辑门电平接口;
  • 封装为 SMD7050-4P,便于高速信号布线与自动化贴装,热性能与机械强度适合工业环境。

四、典型应用

  • 数字系统主/从时钟源(FPGA、CPLD、微处理器);
  • 通信与网络设备的本地振荡与频率参考;
  • 测量仪器、示波器与测试平台;
  • 工业控制、自动化设备与嵌入式系统。

五、封装与使用建议

  • 推荐在电源引脚附近放置 0.1 μF 陶瓷去耦电容,并辅以大容量滤波电容以降低电源噪声;
  • 输出线尽量短且阻抗控制,以减少串扰与反射;必要时在输出与负载间加入缓冲或终端电阻;
  • 焊接时遵循制造商回流曲线,避免过热导致性能偏移或封装损伤;SMD7050-4P 适合标准回流焊工艺。

六、注意事项与可靠性

  • 器件属于精密频率源,请避免在强振动、强冲击下直接使用,必要时采用减震支撑;
  • 安装与调试期间注意静电防护(ESD),避免损伤内部电路;
  • 如需更严格的频率稳定性或更宽温度等级,请与杭晶技术支持联系获取定制或更高等级产品。

如需样品、数据手册或长期可靠性测试报告(HTOL、温循环等),建议直接联系 HCI(杭晶)或其授权分销渠道获取最新资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.