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HCI 8122H-Y40.000NK33DT 8122H
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 8122H-Y40.000NK33DT
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 8122H-Y40.000NK33DT
- Electronic Component
- 1
- Package
- SMD2520-4P
- Electronic Component
- Temperature-Compensated Crystal Oscillator (TCXO)
- Electronic Component
- 0.07g
- Frequency
- 40MHz
- Electronic Component
- 1
- Electronic Component
- BM0264982118
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 3.3V
- Output
- CMOS
- Frequency
- ±2.5ppm
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
8122H-Y40.000NK33DT 产品概述
一、产品简介
8122H-Y40.000NK33DT 是杭晶（HCI）系列高稳定度表贴石英晶体振荡器，标称频率 40.000 MHz，输出模式为 CMOS，工作电压 3.3V，工作温度范围 -40℃ 至 +85℃，封装为 SMD2520-4P（2.5 × 2.0 mm，4 引脚）。本产品定位为需要高频率精度与工业级温度范围的系统时钟源，适用于通信、测量、嵌入式控制与高性能数字电路等领域。
二、主要特性
- 频率：40.000 MHz（标称）
- 频率稳定度：±2.5 ppm（包含温度、老化等典型条件下）
- 输出类型：CMOS（全电平摆幅，兼容 3.3V 数字电平）
- 工作电压：3.3 V ± 容差（详见厂商电气特性）
- 工作温度：-40℃ ~ +85℃（工业级）
- 封装：SMD2520-4P（小型化、表贴安装）
三、性能优势
- 高频率稳定度（±2.5 ppm）保证长期与环境变化下的时钟精度，适合对抖动与频偏敏感的系统。
- CMOS 输出在 3.3V 电源下提供完整的逻辑电平，便于直接驱动 MCU、FPGA、ASIC 等数字芯片，输出驱动能力满足常见负载。
- 小尺寸 SMD2520-4P 封装节省 PCB 空间，适合高密度模块化设计与自动化贴装生产。
- 宽温工作范围满足工业级应用，适用于户外通讯设备、工业控制与仪表等环境。
四、典型应用
- 单片机／FPGA、ASIC 的系统主时钟
- 网络与通信设备（如以太网 PHY、交换机时钟）
- 数据采集、ADC/DAC 同步时钟源
- 精密测量与时序控制系统
- 工业自动化与嵌入式控制模块
五、使用与设计建议
- 电源旁路：在振荡器 VCC 与 GND 之间靠近引脚放置 0.01µF~0.1µF 陶瓷旁路电容，减小电源噪声对输出相位噪声与稳定度的影响。
- 布局布线：输出引脚到负载的走线应尽量短且避免长分支，地线尽量使用连续平面，减少环路电感和干扰耦合。
- 接地处理：若封装有底部焊盘（pad），建议按厂商推荐焊接良好接地，以利散热与 EMI 性能。
- 负载匹配：CMOS 输出通常不需外接负载电容或晶振元件，但应注意负载电流与输入门电容影响，必要时在输出与地之间并入小电阻以改善驱动与反射。
- 焊接与可靠性：遵循厂家推荐的回流焊温度曲线与工艺，避免超出器件热应力限制以保证长期可靠性。
六、选型与注意事项
- 请确认系统对频率稳定度、温漂与老化要求是否与 ±2.5 ppm 相匹配；对更高要求的场合可咨询厂商提供更高精度型号。
- 若对相位噪声、抖动有严格指标，请向供应商索取详细的相位噪声 / RMS 抖动数据表，以便验证满足系统规格。
- 采购时确认封装、引脚定义与贴装方向，配合 PCB 尺寸与加工工艺选择合适的贴片方式与包装形式（卷带、盘装等）。
如需完整电气特性曲线、引脚定义图与回流焊工艺参数，可提供厂家数据手册以供工程验证与量产参考。
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