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HCI 8122H-Y10.000NK33DT 8122H
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 8122H-Y10.000NK33DT
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 8122H-Y10.000NK33DT
- Electronic Component
- 1
- Package
- SMD2520-4P
- Electronic Component
- Temperature-Compensated Crystal Oscillator (TCXO)
- Electronic Component
- 1g
- Frequency
- 10MHz
- Electronic Component
- 1
- Electronic Component
- BM0264982145
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 3.3V
- Output
- CMOS
- Frequency
- ±2.5ppm
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
8122H-Y10.000NK33DT 产品概述
8122H-Y10.000NK33DT 是杭晶（HCI）推出的一款高稳定性贴片晶振，标称频率 10.000 MHz，专为对频率精度与环境适应性有较高要求的便携及工业电子设备设计。器件体积小巧、工作电压低、输出为 CMOS 电平，便于与各类数字电路直接接口。
一、主要规格亮点
- 频率：10.000 MHz
- 频率稳定度：±2.5 ppm（典型环境条件下）
- 输出模式：CMOS（推挽输出，兼容常见数字逻辑）
- 工作电压：3.3 V（标准供电）
- 工作温度范围：-40 ℃ 至 +85 ℃（工业级）
- 封装形式：SMD2520-4P（表面贴装，4 引脚）
二、产品特性与优势
- 高精度：±2.5 ppm 的频率稳定度可满足通信、时钟同步与高精度测量等场景对时间基准的严格要求。
- 工业级温度耐受：-40 ℃ 至 +85 ℃ 的工作温度范围，使其适合工业控制、车载电子与户外设备使用。
- 直接驱动：CMOS 输出提供接近 VCC 的高电平与接近 GND 的低电平，能够直接驱动微控制器、FPGA 与 CPLD 等逻辑输入。
- 封装优势：SMD2520-4P 小尺寸有利于高密度 PCB 布局，适配自动贴装与回流焊工艺，利于规模化生产。
三、典型应用场景
- MCU/MPU 系统时钟源
- 通信设备与网络同步模块
- 工业控制与测试测量设备
- 消费类电子与便携式终端需精确时钟的场合
- FPGA/CPLD 等数字逻辑电路的基准频率源
四、安装与使用建议
- 供电旁路：建议在 VCC 与 GND 之间靠近器件放置 0.01 µF 至 0.1 µF 的去耦电容，以抑制电源噪声对振荡稳定性的影响。
- PCB 布局：减小输出走线长度，避免高速信号线平行耦合；将地平面连续处理以降低 EMI。
- 焊接工艺：遵循典型回流焊温度曲线（符合无铅工艺规范），避免长时间超温，以免影响内部晶体特性。
- 静电防护：在搬运与贴装过程中注意 ESD 防护，减少静电放电对输出缓冲的损伤。
五、可靠性与质保
杭晶（HCI）作为专业晶振制造商，对出厂产品进行严格筛选与温度漂移测试。对于需要批量采购的客户，建议与供应商确认具体的品质保证条款、样品测试报告与老化测试数据，以满足关键应用的可靠性要求。
若需获取封装尺寸图、引脚排列、老化/震动测试数据或样品采购信息，可联系杭晶官方渠道或授权分销商获取更详尽的技术资料与评估支持。
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