WMSIC Electronic Components

HCI 8121S-40.000MQ33DTL 8121S

Model8121S-40.000MQ33DTL
PackageSMD2016-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 8121S-40.000MQ33DTL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
8121S-40.000MQ33DTL
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Temperature-Compensated Crystal Oscillator (TCXO)
Electronic Component
0.41g
Frequency
40MHz
Electronic Component
1
Electronic Component
BM0264982108
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Output
Electronic Component
Frequency
±500ppb
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

8121S-40.000MQ33DTL 产品概述

一、产品简介

8121S-40.000MQ33DTL 是杭晶(HCI)推出的一款高精度温补晶振(TCXO),工作频率为 40.000 MHz。该器件采用 SMD2016-4P 小封装,面向对频率精度与长期稳定性有较高要求的便携与通信类终端设备。输出为削峰正弦波(Clipped Sine Wave),工作电压 3.3V,工作温度范围 -40℃ 至 +85℃,适合工业级应用环境。

二、主要特性

  • 高频率:标称 40.000 MHz,满足各类系统参考时钟需求。
  • 高稳定度:在 -40℃ 至 +85℃ 温度范围内频率稳定度优于 ±0.5 ppm(±500 ppb)。
  • 高初始精度:出厂初始频差 ±1.5 ppm,可减少系统校准工作量。
  • 输出形式:削峰正弦波(Clipped Sine),兼容要求线性差的驱动/接收电路。
  • 小型封装:SMD2016-4P(2.0 × 1.6 mm,4 引脚),适配高密度 PCB 设计。
  • 低压供电:3.3V 工作电压,便于与常见 MCU/FPGA/射频前端配合使用。

三、技术参数

  • 型号:8121S-40.000MQ33DTL
  • 品牌:HCI(杭晶)
  • 频率:40.000 MHz
  • 输出波形:Clipped Sine Wave(削峰正弦)
  • 工作电压:3.3 V
  • 初始精度:±1.5 ppm
  • 频率稳定度(温度补偿后):±0.5 ppm(-40℃ ~ +85℃)
  • 工作温度:-40℃ ~ +85℃
  • 封装:SMD2016-4P,4 引脚表面贴装

(注:以上为主要指标,其他电气特性如输出幅度、相位噪声、启动时间、供电电流等请参见杭晶技术规格书或向厂商索取完整数据手册。)

四、封装与引脚

器件采用标准 SMD2016-4P 封装,四引脚设计利于焊接可靠性与电气接地布局。封装尺寸小,适合空间受限的模块化设计。建议按照厂商推荐的 PCB 封装与回流焊工艺处理,注意避免强烈机械应力与热冲击。

五、典型应用

  • 无线通信基站与终端参考时钟
  • GNSS、北斗等定位接收机的本振或参考源
  • 工业控制与测试测量设备
  • 高精度数据采集与同步系统
  • 消费类与物联网终端需要长期稳定时钟的场景

六、设计与使用建议

  • 电源去耦:在器件电源引脚附近放置合适的旁路电容,减小电源噪声对频率稳定性的影响。
  • 布局:将时钟输入/输出线与高噪声信号(开关电源、数字总线)分离,缩短输出线长度以减少干扰。
  • 焊接工艺:按厂商推荐的回流曲线执行,避免超温或长时间暴露在高温环境。
  • ESD 与可靠性:采用良好接地与防静电措施,装配与调试过程中注意静电防护。
  • 验证:在目标系统温度循环与长期运行条件下进行频率漂移与启动可靠性验证。

七、采购与技术支持

杭晶(HCI)提供该型号的量产供货与技术支持。订购时请确认所需频率、频率公差、封装及出货状态(卷盘/切板)。如需完整电气特性曲线、相位噪声数据或定制温度补偿曲线,请联系杭晶技术支持获取数据手册与评估样品。

如需我帮您整理对应的 PCB 焊盘建议、去耦电容值或在特定应用中替代方案,可继续提供应用场景与电路需求。

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