WMSIC Electronic Components

HCI HCCF2-455.000-LTWCDL HCCF2

ModelHCCF2-455.000-LTWCDL
PackageSMD-4P,11.9x7.5mm
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI HCCF2-455.000-LTWCDL
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
HCCF2-455.000-LTWCDL
Electronic Component
1
Package
SMD-4P,11.9x7.5mm
Electronic Component
10kHz
Electronic Component
Filter
Electronic Component
45dB
Electronic Component
0.91g
Electronic Component
2kΩ
Electronic Component
1
Frequency
455kHz
Electronic Component
BM0264820034
Operating Temperature
20℃~+80℃
Electronic Component
6dB
Filter Type
Filter

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCCF2-455.000-LTWCDL 产品概述

一、产品核心定位与应用场景

HCCF2-455.000-LTWCDL是杭晶电子(HCI)推出的中频陶瓷滤波器,专为455kHz频段的信号滤波设计,核心作用是在复杂电磁环境中提取目标频段信号、抑制带外干扰,具备体积小、性能稳定、抗干扰能力强等特点。

常见应用场景包括:

  • 无线通信模块:FM收音机、短距离无线数据传输(如蓝牙低功耗辅助滤波)、对讲机中频滤波;
  • 消费电子设备:便携式音频播放器、智能手表的无线通信链路;
  • 工业控制设备:低功耗无线传感器网络的信号过滤,确保数据传输可靠性;
  • 汽车电子:车载收音机、胎压监测系统(TPMS)的中频信号处理环节。

二、关键性能参数解析

该产品的核心参数围绕“信号滤波精度”与“系统兼容性”设计,具体解析如下:

  1. 中心频率:455kHz(隐含杭晶精度控制,通常陶瓷滤波器中心频率精度可达±0.1%~±0.5%),匹配全球通用的中频通信频段,无需额外频率校准;
  2. 带宽:10kHz(-3dB带宽),属于窄带滤波,可有效过滤带外噪声与干扰信号,保证目标频段内信号纯度;
  3. 插入损耗:6dB,在同类陶瓷滤波器中处于中等偏优水平,既满足滤波性能,又减少后级放大电路的功耗需求;
  4. 阻抗:2kΩ,与常见射频/中频电路(如运放、LC振荡电路)阻抗匹配,无需额外阻抗转换元件,简化电路设计;
  5. 工作温度:-20℃~+80℃,覆盖消费电子、工业控制等多数场景的温度范围,极端环境下性能稳定,无需额外温度补偿。

三、封装与可靠性设计

  1. 封装规格:SMD-4P(贴片4引脚),尺寸11.9mm×7.5mm,属于小型化贴片封装,适配自动化贴装生产线(SMT),大幅提升生产效率,同时节省PCB板空间,符合电子设备小型化趋势;
  2. 引脚设计:4引脚采用对称布局,便于电路布线,减少信号串扰;
  3. 材料与工艺:采用杭晶特有的压电陶瓷材料(如PZT),经高温烧结、电极沉积等工艺制造,具备低老化率(年老化率<±50ppm)、抗机械振动(符合GB/T 2423.10标准)、抗冲击(符合GB/T 2423.5标准)等特性,可靠性覆盖工业级与消费级设备要求。

四、适用领域与选型优势

  1. 频段适配性:455kHz是全球通用中频通信频段,产品参数与多数通信模块的中频电路完全匹配,无需重新设计滤波网络;
  2. 品牌优势:HCI(杭晶)是国内知名压电陶瓷元器件制造商,拥有10+年陶瓷滤波器研发生产经验,产品一致性好、批量供货稳定,售后保障完善;
  3. 成本效益:在保证性能的前提下,性价比突出,适合大规模量产的消费电子、工业设备使用,无需承担高端滤波器的额外成本。

五、使用注意事项

  1. 焊接工艺:回流焊峰值温度≤260℃(符合J-STD-020标准),焊接时间≤10秒,避免高温损坏陶瓷基体;
  2. 静电防护:陶瓷滤波器对静电敏感,操作时需佩戴防静电手环,使用防静电工作台,避免静电击穿电极;
  3. 电路匹配:因阻抗为2kΩ,需确保前后级电路(放大器、混频器)的输入/输出阻抗匹配,否则会导致插入损耗增大、滤波性能下降;
  4. 安装环境:避免安装在强电磁干扰区域(如靠近大功率电源、射频发射模块),必要时增加屏蔽罩提升抗干扰能力。

综上,HCCF2-455.000-LTWCDL是一款适配455kHz中频滤波需求的高性价比产品,适合对体积、稳定性有要求的消费电子、工业控制及汽车电子领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.