WMSIC Electronic Components

HCI 1532D-156.250K33DTSTL 1532D

Model1532D-156.250K33DTSTL
PackageSMD3225-6P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 1532D-156.250K33DTSTL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
1532D-156.250K33DTSTL
Electronic Component
1
Package
SMD3225-6P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.055g
Frequency
156.25MHz
Electronic Component
1
Electronic Component
BM0264568354
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~3.3V
Electronic Component
±10ppm
Output
LVDS
Frequency
±15ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1532D-156.250K33DTSTL 产品概述

一、产品简介

1532D-156.250K33DTSTL 是杭晶(HCI)推出的一款低抖动差分有源晶振,中心频率为 156.25 MHz,采用 SMD3225-6P 封装,面向对时钟质量及频率稳定性有较高要求的通信与高速数字系统。器件输出为 LVDS 差分信号,工作电压范围 2.5 V ~ 3.3 V,工作温度范围 -40 ℃ ~ +85 ℃,常温初始频差 ±10 ppm,整机频率稳定度可达 ±15 ppm。

二、主要性能

  • 频率:156.25 MHz(高精度晶振,适配高速通信系统)
  • 输出模式:LVDS 差分(适合与 FPGA、SERDES、PHY 等直接接口)
  • 工作电压:2.5 V ~ 3.3 V(兼容主流 2.5V / 3.3V 供电平台)
  • 常温频差:±10 ppm(25 ℃ 标称点)
  • 频率稳定度:±15 ppm(覆盖温度/老化等综合条件)
  • 工作温度:-40 ℃ ~ +85 ℃(工业级温度范围)
  • 封装:SMD3225-6P(3.2 × 2.5 mm,6 引脚表面贴装)

此外,器件采用低抖动设计,能有效降低相位噪声与抖动积累,满足高带宽链路对时钟纯净度的要求。

三、封装与机械特性

  • 封装型号:SMD3225-6P,体积小、焊接可靠,适合高密度 SMT 组装流程。
  • 引脚形式:6 引脚差分有源晶振,便于 PCB 上差分走线与去耦布置。
  • 品牌标识:HCI(杭晶),具备通信级元器件设计与量产能力。

(具体引脚排列与封装尺寸请参照杭晶官方数据手册,以便于布局与安装。)

四、典型应用场景

  • 以太网、光模块与交换设备的主/子时钟源
  • 光通信与接入设备(OLT/ONU、SFP+/QSFP 等光模块时钟)
  • 高速数据采集与 ADC/DAC 时钟
  • FPGA / ASIC 的参考时钟与时钟分发系统
  • 无线基站与通信基站的同步与基带处理模块

五、使用建议

  • 差分走线务必保持恒定差分阻抗(建议 100 Ω),并尽量缩短走线长度以降低串扰与延时不匹配。
  • 在晶振 VCC 引脚附近放置 0.1 μF 和 1 μF 的去耦电容,靠近器件焊盘以保证电源稳定。
  • 接收端建议在差分对末端使用 100 Ω 终端电阻进行差分终端匹配,减少反射。
  • 布局时应保证完整的地平面,避免晶振与高频噪声源并排走线或近距离贴合电源开关芯片。
  • 参考杭晶数据手册的焊盘与回流曲线进行组装,以保证焊点可靠性与回流良率。

六、可靠性与质量保证

本型号为工业级产品,设计考虑温度循环、振动与长期老化特性。杭晶(HCI)提供质量追溯与批次测试数据,出厂前进行振荡频率、输出波形与电气特性检验,满足通信设备对长期稳定工作的需求。

七、订购与技术支持

型号:1532D-156.250K33DTSTL
品牌:HCI(杭晶)
封装:SMD3225-6P
如需样品、批量报价或技术资料(引脚定义、封装图、温漂测试报告、典型时序/波形),请联系杭晶授权代理或销售代表。技术支持包括布局建议、测试方法及可靠性测试数据,便于在目标系统中快速验证与集成。

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