WMSIC Electronic Components

HCI V175D-100.000K33DT1L V175D

ModelV175D-100.000K33DT1L
PackageSMD7050-6P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI V175D-100.000K33DT1L
Type
SMD7050-6P
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
V175D-100.000K33DT1L
Electronic Component
1
Package
SMD7050-6P
Electronic Component
Voltage-Controlled Crystal Oscillator (VCXO)
Electronic Component
1g
Frequency
100MHz
Electronic Component
1
Electronic Component
BM0264779330
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Output
LVDS
Frequency
±15ppm
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

V175D-100.000K33DT1L 产品概述

一、产品简介

V175D-100.000K33DT1L 是杭晶(HCI)推出的一款高性能 VCXO,标称频率 100.000 MHz。器件针对高频率、低相位噪声应用设计,提供 LVDS 差分输出,工作电压 3.3V,工作温度范围 -40℃ 至 +85℃,适合对时钟质量要求较高的通信与测试设备。

二、主要参数

  • 标称频率:100.000 MHz
  • 频率稳定度(常规):±15 ppm(工作温度与静态条件下典型值)
  • 总频差(出厂/规格):±25 ppm
  • 牵引范围(Pull/调谐范围):±100 ppm(通过控制电压调节)
  • 输出方式:LVDS 差分输出
  • 工作电压:3.3 V
  • 工作温度:-40℃ ~ +85℃
  • 封装:SMD 7050-6P(6 引脚)

三、产品特点

  • 高频 100 MHz 输出,适配高速数字和射频前端参考时钟需求。
  • 低相位噪声设计,有助于降低系统抖动并提升接收灵敏度与误码性能。
  • LVDS 差分输出,兼容现代高速逻辑接口,具备良好抗干扰能力与信号完整性。
  • 宽温度与工业级电压规格,适用于工业、通信和测试测量等严苛环境。
  • 小型 SMD7050 封装,便于表面贴装和自动化生产。

四、封装与引脚

V175D 采用 7050-6P 小型封装,6 引脚形式有利于 PCB 布局和接地处理。建议按厂方封装图进行焊盘设计与回流焊流程控制,确保可靠焊接与长寿命工作。详细引脚排列与电气连接请参考产品数据手册。

五、典型应用

  • 光纤通信与以太网 PHY 时钟源
  • 无线基站、射频上变/下变本振参考
  • 高速测试与测量设备时钟基准
  • 精密数字信号处理与同步系统

六、使用建议与注意事项

  • LVDS 差分输出建议在终端放置 100 Ω 差分终端电阻,保证阻抗匹配与最佳信号完整性。
  • 电源引脚靠近器件放置 0.1 µF 陶瓷去耦电容,并配合适当的旁路与滤波,降低电源噪声对相位性能的影响。
  • 控制(牵引)电压范围与接法请参照厂家手册,避免超出推荐电压导致频率漂移或器件损坏。
  • 布局时尽量保持差分线短且等长,采用连续地层(ground plane)以降低 EMI 和相位噪声耦合。
  • 推荐遵循厂家提供的回流焊温度曲线和存储/湿度管理规范(MSL)以保证焊接可靠性。

七、订购与技术支持

型号:V175D-100.000K33DT1L;品牌:HCI(杭晶)。如需详细电气参数、相位噪声谱、引脚定义和应用电路图,请联系供应商或索取最新数据手册与评估样片。厂方可提供定制化频差/温度补偿方案以满足特殊应用需求。

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