WMSIC Electronic Components

HCI CO32P6-156.250-33JDTSTL CO32P6

ModelCO32P6-156.250-33JDTSTL
PackageSMD3225-6P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI CO32P6-156.250-33JDTSTL
Type
SMD3225-6P
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
CO32P6-156.250-33JDTSTL
Electronic Component
1
Package
SMD3225-6P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.099g
Frequency
156.25MHz
Electronic Component
1
Electronic Component
BM0264820030
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~3.3V
Electronic Component
±10ppm
Output
LVPECL
Frequency
±15ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CO32P6-156.250-33JDTSTL 产品概述

一、产品简介

CO32P6-156.250-33JDTSTL 为 HCI(杭晶)出品的低抖动差分有源晶振,中心频率 156.25 MHz,输出采用 LVPECL 差分电平,工作电压范围 2.5 V 至 3.3 V。器件采用 SMD3225-6P(3.2 × 2.5 mm,6 引脚)表贴封装,工作温度 -40 ℃ 至 +85 ℃,常温频差 ±10 ppm,频率稳定度(全过程)可达 ±15 ppm,适用于对时钟精度与相位噪声有较高要求的通信与高速数字系统。

二、主要特点

  • 频率:156.25 MHz,专为高速通信与时钟分配设计。
  • 输出模式:LVPECL 差分输出,信号完整性好,适配高速差分输入。
  • 低抖动设计:优化的振荡单元与封装工艺,适合对抖动敏感的系统。
  • 宽电压范围:支持 2.5 V 至 3.3 V 单电源工作,兼容多种系统电源。
  • 宽温度范围:-40 ℃ 至 +85 ℃ 工业级温度等级。
  • 紧凑封装:SMD3225-6P,便于高密度 PCB 布局与自动贴装。

三、典型规格(简要)

  • 品牌:HCI(杭晶)
  • 型号:CO32P6-156.250-33JDTSTL
  • 频率:156.25 MHz
  • 常温频差:±10 ppm
  • 频率稳定度:±15 ppm(工作温度范围内)
  • 输出电平:LVPECL 差分
  • 工作电压:2.5 V ~ 3.3 V
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SMD3225-6P(3.2 × 2.5 mm,6P)
    (注:更详细的电气参数、相位噪声与抖动性能请参考厂商规范书或咨询技术支持。)

四、典型应用

  • 网络与通信设备时钟源(交换机、路由器、光端机等)
  • 高速数据接口与串行链路时钟(差分输入 FPGA/CPLD/SerDes)
  • 精密采样与同步系统
  • 工业控制与测试测量系统中需要稳定时钟的场合

五、使用建议与注意事项

  • 输出为 LVPECL 差分信号,建议在 PCB 设计中维持差分阻抗一致并使用 100 Ω 差分终端匹配以保证信号完整性。
  • 电源建议使用低噪声稳压源并在供电端加足够的旁路电容,以降低相位噪声与抖动。
  • 封装为表贴型,推荐采用回流焊工艺,遵循厂商给出的回流曲线与贴装注意事项。
  • 频率精度受温度、电源及负载影响,关键应用中建议在系统层面进行校准或使用参考同步机制。
  • 若需更深入的相位噪声、输出波形、驱动能力与推荐电路,请联系 HCI(杭晶)获取完整版数据手册与参考设计。

六、采购与认证

本型号适合批量生产与自动化贴装。关于样品、交期、合规(如 RoHS)与认证信息,请通过官方渠道或授权分销商进行确认与下单,以获得最新的技术支持与品质保证。

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